BA

Bernard Aspar

CEA: 51 patents #11 of 7,956Top 1%
SO Soitec: 16 patents #21 of 259Top 9%
ST S.O.I. Tec Silicon On Insulator Technologies: 9 patents #18 of 155Top 15%
ES E2V Semiconductors: 1 patents #17 of 41Top 45%
📍 Le Fangeat, FR: #1 of 18 inventorsTop 6%
Overall (All Time): #25,561 of 4,157,543Top 1%
75
Patents All Time

Issued Patents All Time

Showing 26–50 of 75 patents

Patent #TitleCo-InventorsDate
8101503 Method of producing a thin layer of semiconductor material Michel Bruel, Thierry Poumeyrol 2012-01-24
8044465 Method for producing partial SOI structures comprising zones connecting a superficial layer and a substrate Chrystelle Lagahe-Blanchard 2011-10-25
7902038 Detachable substrate with controlled mechanical strength and method of producing same Hubert Moriceau, Olivier Rayssac, Bruno Ghyselen 2011-03-08
7883994 Process for the transfer of a thin film Hubert Moriceau, Michel Bruel, Christophe Maleville 2011-02-08
7807482 Method for transferring wafers Chrystelle Lagahe-Blanchard 2010-10-05
7807548 Process of forming and controlling rough interfaces Chrystelle Lagahe Blanchard, Nicolas Sousbie 2010-10-05
7737000 Process for the collective fabrication of microstructures consisting of superposed elements Philippe Rommeveaux 2010-06-15
7713369 Detachable substrate or detachable structure and method for the production thereof Hubert Moriceau, Marc Zussy, Olivier Rayssac 2010-05-11
7709305 Method for producing partial SOI structures comprising zones connecting a superficial layer and a substrate Chrystelle Lagahe-Blanchard 2010-05-04
7615463 Method for making thin layers containing microcomponents Christelle Lagahe, Bruno Ghyselen 2009-11-10
7498234 Method of producing a thin layer of semiconductor material Michel Bruel, Thierry Poumeyrol 2009-03-03
7498245 Embrittled substrate and method for making same Chrystelle Lagahe, Olivier Rayssac, Bruno Ghyselen 2009-03-03
7494897 Method of producing mixed substrates and structure thus obtained Franck Fournel, Hubert Moriceau, Marc Zussy 2009-02-24
7368030 Intermediate suction support and its utilisation for producing a thin film structure Claude Jaussaud, Michel Bruel 2008-05-06
7264996 Method for separating wafers bonded together to form a stacked structure Hubert Moriceau, Frank Fournel 2007-09-04
7258743 Composite structure with a uniform crystal orientation and the method of controlling the crystal orientation of one such structure Franck Fournel, Hubert Moriceau 2007-08-21
7238598 Formation of a semiconductor substrate that may be dismantled and obtaining a semiconductor element Chrystelle Lagahe, Aurélie Beaumont 2007-07-03
7229899 Process for the transfer of a thin film Hubert Moriceau, Michel Bruel, Christophe Maleville 2007-06-12
7205211 Method for handling semiconductor layers in such a way as to thin same Marc Zussy, Jean-Frederic Clerc 2007-04-17
7067396 Method of producing a thin layer of semiconductor material Michel Bruel, Thierry Poumeyrol 2006-06-27
7060590 Layer transfer method Severine Bressot, Olivier Rayssac 2006-06-13
7029548 Method for cutting a block of material and forming a thin film Chrystelle Lagache 2006-04-18
6974759 Method for making a stacked comprising a thin film adhering to a target substrate Hubert Moriceau, Eric Jalaguier, Fabrice Letertre 2005-12-13
6959863 Method for selectively transferring at least an element from an initial support onto a final support Christophe Figuet, Vincent Blet 2005-11-01
6946365 Method for producing a thin film comprising introduction of gaseous species Michel Bruel 2005-09-20