Issued Patents All Time
Showing 26–50 of 82 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8841742 | Low temperature layer transfer process using donor structure with material in recesses in transfer layer, semiconductor structures fabricated using such methods | Ionut Radu | 2014-09-23 |
| 8778773 | Methods for directly bonding together semiconductor structures, and bonded semiconductor structures formed using such methods | — | 2014-07-15 |
| 8728863 | Methods of forming bonded semiconductor structures including interconnect layers having one or more of electrical, optical, and fluidic interconnects therein, and bonded semiconductor structures formed using such methods | Bich-Yen Nguyen | 2014-05-20 |
| 8716105 | Methods for bonding semiconductor structures involving annealing processes, and bonded semiconductor structures and intermediate structures formed using such methods | Ionut Radu, Didier Landru | 2014-05-06 |
| 8697493 | Bonding surfaces for direct bonding of semiconductor structures | — | 2014-04-15 |
| 8673733 | Methods of transferring layers of material in 3D integration processes and related structures and devices | Ionut Radu | 2014-03-18 |
| 8637995 | Bonded semiconductor structures including two or more processed semiconductor structures carried by a common substrate | — | 2014-01-28 |
| 8617925 | Methods of forming bonded semiconductor structures in 3D integration processes using recoverable substrates, and bonded semiconductor structures formed by such methods | Bich-Yen Nguyen | 2013-12-31 |
| 8501537 | Methods for bonding semiconductor structures involving annealing processes, and bonded semiconductor structures formed using such methods | Ionut Radu, Didier Landru, Lea Di Cioccio | 2013-08-06 |
| 8481406 | Methods of forming bonded semiconductor structures | Ionut Radu | 2013-07-09 |
| 8461017 | Methods of forming bonded semiconductor structures using a temporary carrier having a weakened ion implant region for subsequent separation along the weakened region | Ionut Radu | 2013-06-11 |
| 8440539 | Isolation trench processing for strain control | Michael A. Mendicino | 2013-05-14 |
| 8338294 | Methods of forming bonded semiconductor structures including two or more processed semiconductor structures carried by a common substrate, and semiconductor structures formed by such methods | — | 2012-12-25 |
| 8125032 | Modified hybrid orientation technology | Olubunmi O. Adetutu, Ted R. White, Bich-Yen Nguyen | 2012-02-28 |
| 8058158 | Hybrid semiconductor substrate including semiconductor-on-insulator region and method of making the same | Konstantin Bourdelle, Bich-Yen Nguyen | 2011-11-15 |
| 7927956 | Method for making a semiconductor structure using silicon germanium | Marius Orlowski, Alexander L. Barr, Ted R. White | 2011-04-19 |
| 7821067 | Electronic devices including a semiconductor layer | Voon-Yew Thean, Brian J. Goolsby, Linda B. McCormick, Bich-Yen Nguyen, Colita M. Parker +3 more | 2010-10-26 |
| 7811382 | Method for forming a semiconductor structure having a strained silicon layer | Alexander L. Barr, Bich-Yen Nguyen, Voon-Yew Thean, Ted R. White | 2010-10-12 |
| 7803670 | Twisted dual-substrate orientation (DSO) substrates | Ted R. White, Leo Mathew, Bich-Yen Nguyen, Zhonghai Shi, Voon-Yew Thean | 2010-09-28 |
| 7781840 | Semiconductor device structure | Ted R. White, Alexander L. Barr, Bich-Yen Nguyen, Marius Orlowski, Voon-Yew Thean | 2010-08-24 |
| 7754587 | Silicon deposition over dual surface orientation substrates to promote uniform polishing | Gregory S. Spencer, Peter J. Beckage | 2010-07-13 |
| 7700420 | Integrated circuit with different channel materials for P and N channel transistors and method therefor | Voon-Yew Thean, Bich-Yen Nguyen, Victor H. Vartanian, Ted R. White | 2010-04-20 |
| 7675090 | Semiconductor device having a contact on a buffer layer thereof and method of forming the same | Berinder Brar, Wonill Ha, Chanh Nguyen | 2010-03-09 |
| 7655963 | Semiconductor device including a lateral field-effect transistor and Schottky diode | Berinder Brar, Wonill Ha, Chanh Nguyen | 2010-02-02 |
| 7615806 | Method for forming a semiconductor structure and structure thereof | Voon-Yew Thean, Jian Chen, Bich-Yen Nguyen, Da Zhang | 2009-11-10 |