Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Methods of making and using a chemical-mechanical polishing slurry that reduces wafer defects

Methods of making and using a chemical-mechanical polishing slurry that reduces wafer defects

US Patent 5934978 · Granted Aug 10, 1999

Estimated economic value: $2,113,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Process of forming an electronic device including a component structure adjacent2025
Method for forming transistor devices having source region segments and body reg2025
Methods and structures for contacting shield conductor in a semiconductor device2025
Integrated transistor and resistor-diode-capacitor snubber2024
Methods and structures for contacting shield conductor in a semiconductor device2024
Transistor device having a source region segments and body region segments2024
Semiconductor device and structure therefor2023
Transistor device having a source region segments and body region segments2023
Methods and structures for contacting shield conductor in a semiconductor device2022
Semiconductor devices with low resistance gate and shield electrodes and methods2022
Method of forming a semiconductor device and structure therefor2022
Transistor device having a source region segments and body region segments2021