Issued Patents All Time
Showing 26–50 of 56 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10700090 | Three-dimensional flat NAND memory device having curved memory elements and methods of making the same | Zhixin Cui, Yanli Zhang | 2020-06-30 |
| 10700078 | Three-dimensional flat NAND memory device having curved memory elements and methods of making the same | Zhixin Cui, Yanli Zhang | 2020-06-30 |
| 10629675 | Three-dimensional memory device containing capacitor pillars and methods of making the same | Hardwell Chibvongodze | 2020-04-21 |
| 10622367 | Three-dimensional memory device including three-dimensional bit line discharge transistors and method of making the same | Hardwell Chibvongodze | 2020-04-14 |
| 10600800 | Three-dimensional memory device containing multilevel drain select gate isolation and methods of making the same | Shinsuke Yada, Yanli Zhang | 2020-03-24 |
| 10580787 | Three-dimensional memory device containing dummy antenna diodes | Fumiaki Toyama | 2020-03-03 |
| 10559582 | Three-dimensional memory device containing source contact to bottom of vertical channels and method of making the same | Shinsuke Yada, Masanori Tsutsumi | 2020-02-11 |
| 10516025 | Three-dimensional NAND memory containing dual protrusion charge trapping regions and methods of manufacturing the same | Hisakazu Otoi, Akio Nishida | 2019-12-24 |
| 10515897 | Three-dimensional memory device containing hydrogen diffusion blocking structures and method of making the same | Akio Nishida, Murshed Chowdhury, Takahito Fujita, Kiyokazu Shishido, Hiroyuki Ogawa | 2019-12-24 |
| 10475804 | Three-dimensional memory device containing multilevel drain select gate isolation and methods of making the same | Shinsuke Yada, Yanli Zhang | 2019-11-12 |
| 10381376 | Three-dimensional flat NAND memory device including concave word lines and method of making the same | Xiaolong Hu, Yanli Zhang | 2019-08-13 |
| 10354987 | Three-dimensional memory device containing bonded chip assembly with through-substrate via structures and method of making the same | Mitsuteru Mushiga, Akio Nishida, Kenji Sugiura, Hisakazu Otoi | 2019-07-16 |
| 10354980 | Three-dimensional memory device containing bonded chip assembly with through-substrate via structures and method of making the same | Mitsuteru Mushiga, Akio Nishida, Kenji Sugiura, Hisakazu Otoi | 2019-07-16 |
| 9941297 | Vertical resistor in 3D memory device with two-tier stack | Kota Funayama, Toru Miwa, Hiroyuki Ogawa | 2018-04-10 |
| 9935123 | Within array replacement openings for a three-dimensional memory device | Masafumi Miyamoto, James Kai | 2018-04-03 |
| 9935124 | Split memory cells with unsplit select gates in a three-dimensional memory device | Masafumi Miyamoto, Hiroyuki Ogawa | 2018-04-03 |
| 9911748 | Epitaxial source region for uniform threshold voltage of vertical transistors in 3D memory devices | Kiyohiko Sakakibara, Hiroyuki Ogawa, Shuji Minagawa | 2018-03-06 |
| 9859422 | Field effect transistor with elevated active regions and methods of manufacturing the same | Akira Inoue, Fumiaki Toyama | 2018-01-02 |
| 9837431 | 3D semicircular vertical NAND string with recessed inactive semiconductor channel sections | Hiroaki Iuchi, Masafumi Miyamoto | 2017-12-05 |
| 9799670 | Three dimensional NAND device containing dielectric pillars for a buried source line and method of making thereof | Jin Liu, Chun Ge, Yanli Zhang | 2017-10-24 |
| 9691781 | Vertical resistor in 3D memory device with two-tier stack | Kota Funayama, Toru Miwa, Hiroyuki Ogawa | 2017-06-27 |
| 9646981 | Passive devices for integration with three-dimensional memory devices | Ryoichi Honma, Toru Miwa, Masahide Matsumoto, Yuki Mizutani, Hiroaki Koketsu | 2017-05-09 |
| 9616698 | Bookbinding apparatus | Yoshihiro Noguchi, Atsushi HIROSHIMA | 2017-04-11 |
| 9620512 | Field effect transistor with a multilevel gate electrode for integration with a multilevel memory device | Hiroaki Koketsu, Fumiaki Toyama, Junji Oh | 2017-04-11 |
| 9589981 | Passive devices for integration with three-dimensional memory devices | Ryoichi Honma, Toru Miwa, Hiroaki Koketsu, Johann Alsmeier | 2017-03-07 |