Issued Patents All Time
Showing 26–50 of 86 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9123716 | Method for bonding two silicon substrates, and a correspondeing system of two silicon substrates | Julian Gonska, Jens Frey, Timo Schary, Thomas Mayer | 2015-09-01 |
| 9067778 | Method for manufacturing a hybrid integrated component | Johannes Classen | 2015-06-30 |
| 9048247 | Method for producing a metal structure in a semiconductor substrate | — | 2015-06-02 |
| 9040336 | Method for manufacturing a cap for a MEMS component, and hybrid integrated component having such a cap | Johannes Classen, Axel Franke, Jens Frey, Frank Fischer, Patrick Wellner | 2015-05-26 |
| 9035432 | Component having through-hole plating, and method for its production | Jochen Reinmuth, Timo Schary, Yvonne Bergmann | 2015-05-19 |
| 8993356 | Method for constructing an electrical circuit, and electrical circuit | Tjalf Pirk, Juergen Butz, Axel Franke, Frieder Haag, Arnim Hoechst +1 more | 2015-03-31 |
| 8975118 | Component having a via and method for manufacturing it | Julian Gonska, Jens Frey, Eckhard Graf, Roman Schlosser | 2015-03-10 |
| 8847336 | Micromechanical component having an inclined structure and corresponding manufacturing method | Tjalf Pirk, Stefan Pinter, Hubert Benzel, Michael Krueger, Robert Sattler +5 more | 2014-09-30 |
| 8836053 | Hybrid integrated component and method for the manufacture thereof | Frank Fischer, Mirko Hattass, Yvonne Bergmann | 2014-09-16 |
| 8823116 | Hybrid integrated component and method for the manufacture thereof | — | 2014-09-02 |
| 8779536 | Hybrid integrated pressure sensor component | — | 2014-07-15 |
| RE44995 | Method for producing a semiconductor component and a semiconductor component produced according to the method | Hubert Benzel, Hans Artmann, Frank Schaefer | 2014-07-08 |
| 8759136 | Method for creating monocrystalline piezoresistors | Hubert Benzel | 2014-06-24 |
| 8748998 | Sensor module | Jens Frey, Eckhard Graf | 2014-06-10 |
| 8679975 | Method for forming trenches in a semiconductor component | Jochen Reinmuth, Barbara Will | 2014-03-25 |
| 8659099 | Method for manufacturing a micromechanical structure, and micromechanical structure | Jochen Reinmuth | 2014-02-25 |
| 8647961 | Method for filling cavities in wafers, correspondingly filled blind hole and wafer having correspondingly filled insulation trenches | Jens Frey, Eckhard Graf, Roman Schlosser | 2014-02-11 |
| 8607447 | Method for providing and connecting two contact areas of a semiconductor component or a substrate, and a substrate having two such connected contact areas | Jochen Reinmuth | 2013-12-17 |
| 8564078 | Method for producing a micromechanical component having a trench structure for backside contact | Roland Scheuerer, Eckhard Graf | 2013-10-22 |
| 8558327 | Micromechanical component and corresponding production method | Kathrin Knese, Simon Armbruster | 2013-10-15 |
| 8530260 | Method for attaching a first carrier device to a second carrier device and micromechanical components | Julian Gonska, Axel Grosse, Ralf Hausner | 2013-09-10 |
| 8485041 | Sensor system, method for operating a sensor system, and method for manufacturing a sensor system | Marcus Ahles, Hubert Benzel | 2013-07-16 |
| 8419957 | Method for producing a micromechanical component having a filler layer and a masking layer | Roland Scheuerer, Eckhard Graf | 2013-04-16 |
| 8298962 | Device made of single-crystal silicon | Arnd Kaelberer, Helmut Baumann, Roland Scheuerer | 2012-10-30 |
| 8207585 | Method for producing a micromechanical component and mircomechanical component | Roman Schlosser, Christoph Schelling | 2012-06-26 |