Issued Patents All Time
Showing 51–75 of 93 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10687253 | Resource reservation on networks comprising wireless and wired segments | Michael McBride, Subhasri Dhesikan, Neil R. Diener, David Sheldon Stephenson | 2020-06-16 |
| 10638423 | Group wake-up and keep-alive indication | Guoqing Li, Yong Liu, Oren Shani, Xiaowen Wang, Christiaan A. Hartman +5 more | 2020-04-28 |
| 10510733 | Integrated device comprising embedded package on package (PoP) device | Chin-Kwan Kim, Milind Shah | 2019-12-17 |
| 10496248 | Disk utilization analysis | Vishal Anand, Sahadev Dey, Vijay S. Patil, Amit Patra | 2019-12-03 |
| 10163871 | Integrated device comprising embedded package on package (PoP) device | Chin-Kwan Kim, Milind Shah | 2018-12-25 |
| 10073594 | Disk utilization analysis | Vishal Anand, Sahadev Dey, Vijay S. Patil, Amit Patra | 2018-09-11 |
| 10037941 | Integrated device package comprising photo sensitive fill between a substrate and a die | Vladimir Noveski, Milind Shah | 2018-07-31 |
| 9947642 | Package-on-Package (PoP) device comprising a gap controller between integrated circuit (IC) packages | Chin-Kwan Kim, Brian Roggeman | 2018-04-17 |
| 9823814 | Disk utilization analysis | Vishal Anand, Sahadev Dey, Vijay S. Patil, Amit Patra | 2017-11-21 |
| 9806063 | Reinforced wafer level package comprising a core layer for reducing stress in a solder joint and improving solder joint reliability | Chin-Kwan Kim, Vladimir Noveski, Jie Fu, Ahmer Syed, Milind Shah +1 more | 2017-10-31 |
| 9763140 | Resource reservation on networks comprising wireless and wired segments | Michael McBride, Subhasri Dhesikan, Neil R. Diener, David Sheldon Stephenson | 2017-09-12 |
| 9641047 | Auxiliary power module | Raymond Collett, Hao Zhang | 2017-05-02 |
| 9601435 | Semiconductor package with embedded components and method of making the same | Chin-Kwan Kim, David Fraser Rae, Milind Shah, Omar J. Bchir | 2017-03-21 |
| 9536805 | Power management integrated circuit (PMIC) integration into a processor package | Siamak Fazelpour, Jiantao Zheng, Mario Francisco Velez, Sun Hyuck Yun, Houssam Jomaa | 2017-01-03 |
| 9461008 | Solder on trace technology for interconnect attachment | Omar J. Bchir | 2016-10-04 |
| 9460980 | Systems, apparatus, and methods for heat dissipation | Sun Woong Yun, Houssam Jomaa, Joan Rey Villarba BUOT | 2016-10-04 |
| 9355898 | Package on package (PoP) integrated device comprising a plurality of solder resist layers | Houssam Jomaa, David Fraser Rae, Layal Rouhana, Omar J. Bchir | 2016-05-31 |
| 9172796 | Location based mixer priorities in conferences | Sravan Vadlakonda, Ashish Chotai, Aseem Asthana, Shmuel Shaffer | 2015-10-27 |
| 9159670 | Ultra fine pitch and spacing interconnects for substrate | Chin-Kwan Kim, Omar J. Bchir | 2015-10-13 |
| 9105626 | High-density package-on-package structure | — | 2015-08-11 |
| 8772951 | Ultra fine pitch and spacing interconnects for substrate | Chin-Kwan Kim, Omar J. Bchir | 2014-07-08 |
| 8686749 | Thermal interface material, test structure and method of use | Brian M. Erwin, David L. Gardell, James N. Humenik, John R. Lawson | 2014-04-01 |
| 8492910 | Underfill method and chip package | Michael A. Gaynes, Thomas E. Lombardi, Steve Ostrander | 2013-07-23 |
| 8444043 | Uniform solder reflow fixture | William E. Bernier, Marcus E. Interrante, Chenzhou Lian, Janak G. Patel, Peter Slota, Jr. | 2013-05-21 |
| 8411629 | Dynamic admission control of wireless video to a wireless network | Lu Qian, Sandeep Jay Shetty, Neil R. Diener, Tak Ming Pang | 2013-04-02 |