Issued Patents All Time
Showing 26–45 of 45 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10937741 | Molded laser package with electromagnetic interference shield and method of making | DeokKyung Yang, HeeSoo Lee, Wanil Lee, SANGDUK LEE | 2021-03-02 |
| 10804119 | Method of forming SIP module over film layer | OhHan Kim, Kyunghwan KIM, WoonJae Beak, InSang Yoon | 2020-10-13 |
| 10797039 | Semiconductor device and method of forming a 3D interposer system-in-package module | DeokKyung Yang, OhHan Kim, HeeSoo Lee, InSang Yoon, Il Kwon Shim | 2020-10-06 |
| 10790268 | Semiconductor device and method of forming a 3D integrated system-in-package module | DeokKyung Yang, HeeSoo Lee | 2020-09-29 |
| 10700011 | Semiconductor device and method of forming an integrated SIP module with embedded inductor or package | DeokKyung Yang, WoonJae Beak, YiSu Park, OhHan Kim, HeeSoo Lee | 2020-06-30 |
| 10636756 | Semiconductor device and method of forming protrusion E-bar for 3D SIP | DeokKyung Yang, OhHan Kim, HeeSoo Lee, DaeHyeok Ha, Wanil Lee | 2020-04-28 |
| 10636774 | Semiconductor device and method of forming a 3D integrated system-in-package module | DeokKyung Yang, HeeSoo Lee | 2020-04-28 |
| 10468384 | Semiconductor device and method of forming embedded die substrate, and system-in-package modules with the same | DeokKyung Yang, Sungsoo Kim, HeeSoo Lee | 2019-11-05 |
| 10388637 | Semiconductor device and method of forming a 3D interposer system-in-package module | OhHan Kim, DeokKyung Yang, InSang Yoon, Il Kwon Shim | 2019-08-20 |
| 9721921 | Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer form | KyungMoon Kim, KooHong Lee, JaeHak Yee, YoungChul Kim, Lan H. Hoang +3 more | 2017-08-01 |
| 9524958 | Semiconductor device and method of individual die bonding followed by simultaneous multiple die thermal compression bonding | JoonYoung Choi, YongHee Kang, KeonTaek Kang, YoungChul Kim | 2016-12-20 |
| 9287204 | Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer form | KyungMoon Kim, KooHong Lee, JaeHak Yee, YoungChul Kim, Lan H. Hoang +3 more | 2016-03-15 |
| 9252130 | Methods of manufacturing flip chip semiconductor packages using double-sided thermal compression bonding | KyungMoon Kim, YoungChul Kim, KeonTaek Kang, HeeJo Chi | 2016-02-02 |
| 9236332 | Semiconductor device and method of forming vertically offset bond on trace interconnect structure on leadframe | Reza A. Pagaila, KiYoun Jang | 2016-01-12 |
| 8936969 | Semiconductor device and method of singulating semiconductor wafer along modified region within non-active region formed by irradiating energy through mounting tape | DaeWook Yang, Yeongbeom Ko | 2015-01-20 |
| 8563418 | Semiconductor device and method of forming vertically offset bond on trace interconnects on different height traces | Reza A. Pagaila, KiYoun Jang | 2013-10-22 |
| 8524537 | Semiconductor device and method of forming protective coating material over semiconductor wafer to reduce lamination tape residue | JaEun Yun, SeungYong Chai, WonJun Ko | 2013-09-03 |
| 8409978 | Semiconductor device and method of forming vertically offset bond on trace interconnect structure on leadframe | Reza A. Pagaila, KiYoun Jang | 2013-04-02 |
| 8039384 | Semiconductor device and method of forming vertically offset bond on trace interconnects on different height traces | Reza A. Pagaila, KiYoun Jang | 2011-10-18 |
| 7868468 | Wire bonding structure and method that eliminates special wire bondable finish and reduces bonding pitch on substrates | Rajendra D. Pendse, Byung Joon Han | 2011-01-11 |