Issued Patents All Time
Showing 25 most recent of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7615477 | Method of fabricating a BGA package having decreased adhesion | John U. Knickerbocker, Voya R. Markovich, Thomas R. Miller | 2009-11-10 |
| 7547577 | Method of making circuitized substrate with solder paste connections | Norman A. Card, Thomas R. Miller | 2009-06-16 |
| 7259333 | Composite laminate circuit structure | Robert M. Japp, Gregory Kevern | 2007-08-21 |
| 7148566 | Method and structure for an organic package with improved BGA life | John U. Knickerbocker, Voya R. Markovich, Thomas R. Miller | 2006-12-12 |
| 6845557 | Method for producing an electronic package possessing controlled impedance characteristics | Thomas R. Miller, Robert J. Testa, Kevin Unger, Michael Wozniak | 2005-01-25 |
| 6841026 | Method for reducing coefficient of thermal expansion in chip attach packages | Lawrence Robert Blumberg, Robert M. Japp, John Frank Surowka | 2005-01-11 |
| 6834426 | Method of fabricating a laminate circuit structure | Robert M. Japp, Gregory Kevern | 2004-12-28 |
| 6781064 | Printed circuit boards for electronic device packages having glass free non-conductive layers and method of forming same | Bernd Karl Appelt, Anilkumar C. Bhatt, James W. Fuller, John M. Lauffer, Voya R. Markovich +1 more | 2004-08-24 |
| 6739048 | Process of fabricating a circuitized structure | Gerald W. Jones, Ross W. Keesler, Voya R. Markovich, James Warren Wilson, William E. Wilson | 2004-05-25 |
| 6699736 | Electrical coupling of a stiffener to a chip carrier | Terry J. Dornbos, Raymond Phillips, Mark V. Pierson, David L. Thomas | 2004-03-02 |
| 6639638 | LCD cover optical structure and method | Ramesh R. Kodnani, Mark V. Pierson, David B. Stone | 2003-10-28 |
| 6586352 | Method for reducing coefficient of thermal expansion in chip attach packages | Lawrence Robert Blumberg, Robert M. Japp, John Frank Surowka | 2003-07-01 |
| 6534848 | Electrical coupling of a stiffener to a chip carrier | Terry J. Dornbos, Raymond Phillips, Mark V. Pierson, David L. Thomas | 2003-03-18 |
| 6469256 | Structure for high speed printed wiring boards with multiple differential impedance-controlled layers | Thomas R. Miller, Robert J. Testa, Kevin Unger, Michael Wozniak | 2002-10-22 |
| 6399896 | Circuit package having low modulus, conformal mounting pads | Frank J. Downes, Jr., Donald S. Farquhar, Robert M. Japp | 2002-06-04 |
| 6387830 | Method for reducing coefficient of thermal expansion in chip attach packages | Lawrence Robert Blumberg, Robert M. Japp, John Frank Surowka | 2002-05-14 |
| 6348738 | Flip chip assembly | Jean Dery, Frank D. Egitto, Luis J. Matienzo, Charles Ouellet, Luc Ouellet +2 more | 2002-02-19 |
| 6306683 | Method of forming a flip chip assembly, and a flip chip assembly formed by the method | Jean Dery, Frank D. Egitto, Luis J. Matienzo, Charles Ouellet, Luc Ouellet +2 more | 2001-10-23 |
| 6136733 | Method for reducing coefficient of thermal expansion in chip attach packages | Lawrence Robert Blumberg, Robert M. Japp, John Frank Surowka | 2000-10-24 |
| 6131279 | Integrated manufacturing packaging process | Gerald W. Jones, Ross W. Keesler, Voya R. Markovich, James Warren Wilson, William E. Wilson | 2000-10-17 |
| 6096665 | Technique for forming resin-impregnated fiberglass sheets with improved resistance to pinholing | Bernd Karl Appelt, Robert M. Japp, Kostantinos Papathomas | 2000-08-01 |
| 6074895 | Method of forming a flip chip assembly | Jean Dery, Frank D. Egitto, Luis J. Matienzo, Charles Ouellet, Luc Ouellet +2 more | 2000-06-13 |
| 5981880 | Electronic device packages having glass free non conductive layers | Bernd Karl Appelt, Anilkumar C. Bhatt, James W. Fuller, John M. Lauffer, Voya R. Markovich +1 more | 1999-11-09 |
| 5955782 | Apparatus and process for improved die adhesion to organic chip carriers | Stephen J. Kosteva, David Michael Passante, David J. Russell, Jonathan C. Whitcomb | 1999-09-21 |
| 5919525 | Technique for forming resin-impregnated fiberglass sheets using multiple resins | Bernd Karl Appelt, Robert M. Japp, Kostantinos Papathomas | 1999-07-06 |