Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11676900 | Electronic assembly that includes a bridge | Eric J. Li, Nitin A. Deshpande, Shawna M. Liff, Omkar G. Karhade, Amram Eitan | 2023-06-13 |
| 11075166 | Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrate | Eric J. Li, Yoshihiro Tomita, Shawna M. Liff, Amram Eitan, Mark Saltas | 2021-07-27 |
| 10845552 | Coreless package architecture for multi-chip opto-electronics | Shawna M. Liff, Henning Braunisch, Prasanna Raghavan, Yikang Deng, Zhiguo Qian | 2020-11-24 |
| 10790231 | Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrate | Eric J. Li, Yoshihiro Tomita, Shawna M. Liff, Amram Eitan, Mark Saltas | 2020-09-29 |
| 10418329 | Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrate | Eric J. Li, Yoshihiro Tomita, Shawna M. Liff, Amram Eitan, Mark Saltas | 2019-09-17 |
| 9786517 | Ablation method and recipe for wafer level underfill material patterning and removal | Rajendra C. Dias, Lars D. Skoglund, Anil R. Indluru, Edward R. Prack, Danish Faruqui +2 more | 2017-10-10 |
| 7740713 | Flux composition and techniques for use thereof | Eric Duchesne, Michael A. Gaynes, Kang-Wook Lee, Valerie Oberson | 2010-06-22 |
| 7101782 | Method of making a circuitized substrate | Donald I. Mead | 2006-09-05 |
| 7037819 | Method of making a circuitized substrate | Donald I. Mead | 2006-05-02 |
| 6818988 | Method of making a circuitized substrate and the resultant circuitized substrate | Donald I. Mead | 2004-11-16 |
| 6805974 | Lead-free tin-silver-copper alloy solder composition | Won Kook Choi, Charles C. Goldsmith, Donald W. Henderson, Sung Kwon Kang, Karl J. Puttlitz +1 more | 2004-10-19 |