Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12362250 | Protruding SN substrate features for epoxy flow control | Edvin Cetegen, Jacob VEHONSKY, Nicholas S. Haehn, Thomas HEATON, Steve Cho +5 more | 2025-07-15 |
| 12334453 | Soldered metallic reservoirs for enhanced transient and steady-state thermal performance | Nicholas S. Haehn, Sergio Antonio Chan Arguedas, Edvin Cetegen, Jacob VEHONSKY, Steve Cho +4 more | 2025-06-17 |
| 12266589 | Enhanced base die heat path using through-silicon vias | Weston BERTRAND, Kyle Arrington, Shankar Devasenathipathy, Aaron McCann, Zhimin Wan | 2025-04-01 |
| 12261150 | Mold shelf package design and process flow for advanced package architectures | Wei Li, Edvin Cetegen, Nicholas S. Haehn, Ram Viswanath, Mitul Modi | 2025-03-25 |
| 12087731 | No mold shelf package design and process flow for advanced package architectures | Wei Li, Edvin Cetegen, Nicholas S. Haehn, Ram Viswanath, Mitul Modi | 2024-09-10 |
| 12057369 | Enhanced base die heat path using through-silicon vias | Weston BERTRAND, Kyle Arrington, Shankar Devasenathipathy, Aaron McCann, Zhimin Wan | 2024-08-06 |
| 12009271 | Protruding SN substrate features for epoxy flow control | Edvin Cetegen, Jacob VEHONSKY, Nicholas S. Haehn, Thomas HEATON, Steve Cho +5 more | 2024-06-11 |
| 11942393 | Substrate with thermal insulation | Wei Li, Edvin Cetegen, Nicholas S. Haehn, Mitul Modi | 2024-03-26 |
| 11901333 | No mold shelf package design and process flow for advanced package architectures | Wei Li, Edvin Cetegen, Nicholas S. Haehn, Ram Viswanath, Mitul Modi | 2024-02-13 |
| 11901262 | Cooling solution including microchannel arrays and methods of forming the same | Zhimin Wan, Shankar Devasenathipathy, Je-Young Chang | 2024-02-13 |
| 11854935 | Enhanced base die heat path using through-silicon vias | Weston BERTRAND, Kyle Arrington, Shankar Devasenathipathy, Aaron McCann, Zhimin Wan | 2023-12-26 |
| 11832419 | Full package vapor chamber with IHS | Nicholas S. Haehn, Je-Young Chang, Kyle Arrington, Aaron McCann, Edvin Cetegen +4 more | 2023-11-28 |
| 11804418 | Direct liquid micro jet (DLMJ) structures for addressing thermal performance at limited flow rate conditions | Je-Young Chang, Jae Whan Kim, Ravindranath V. Mahajan | 2023-10-31 |
| 11776864 | Corner guard for improved electroplated first level interconnect bump height range | Jacob VEHONSKY, Nicholas S. Haehn, Thomas HEATON, Steve Cho, Rahul Jain +4 more | 2023-10-03 |
| 11640929 | Thermal management solutions for cored substrates | Divya Mani, Nicholas S. Haehn | 2023-05-02 |
| 11594463 | Substrate thermal layer for heat spreader connection | Nicholas S. Haehn | 2023-02-28 |
| 11587843 | Thermal bump networks for integrated circuit device assemblies | Prasad Ramanathan, Chandra Mohan Jha | 2023-02-21 |
| 10553548 | Methods of forming multi-chip package structures | Nicholas S. Haehn | 2020-02-04 |
| 10461011 | Microelectronics package with an integrated heat spreader having indentations | David W. Mendel, Chandra Mohan Jha, Kelly Lofgreen | 2019-10-29 |