Issued Patents All Time
Showing 1–25 of 86 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11887908 | Electronic package structure with offset stacked chips and top and bottom side cooling lid | Kamal K. Sikka, Katsuyuki Sakuma, Shidong Li, Ravi K. Bonam | 2024-01-30 |
| 11545444 | Mitigating cooldown peeling stress during chip package assembly | Mukta G. Farooq, Katsuyuki Sakuma, Krishna R. Tunga | 2023-01-03 |
| 11430710 | Lid/heat spreader having targeted flexibility | Shidong Li, Jay A. Bunt, Kenneth C. Marston, Hongqing Zhang, David J. Lewison | 2022-08-30 |
| 11302651 | Laminated stiffener to control the warpage of electronic chip carriers | Kamal K. Sikka, Krishna R. Tunga, Thomas Weiss, Shidong Li, Sushumna Iruvanti | 2022-04-12 |
| 11146003 | Pluggable LGA socket for high density interconnects | Alan F. Benner, Benjamin V. Fasano, Paul F. Fortier | 2021-10-12 |
| 10978314 | Multi integrated circuit chip carrier package | Marcus E. Interrante, Kathryn R. Lange, Kamal K. Sikka, Tuhin Sinha, Jeffrey A. Zitz | 2021-04-13 |
| 10905029 | Cooling structure for electronic boards | Paul F. Bodenweber, Kenneth C. Marston, Kamal K. Sikka, Randall J. Werner, Jeffrey A. Zitz | 2021-01-26 |
| 10892170 | Fabricating an integrated circuit chip module with stiffening frame and orthogonal heat spreader | Evan G. Colgan, Yi Pan, Jeffrey A. Zitz | 2021-01-12 |
| 10832987 | Managing thermal warpage of a laminate | Charles L. Arvin, Marcus E. Interrante, Thomas E. Lombardi, Krishna R. Tunga, Thomas Weiss | 2020-11-10 |
| 10757833 | Cooling structure for electronic boards | Paul F. Bodenweber, Kenneth C. Marston, Kamal K. Sikka, Randall J. Werner, Jeffrey A. Zitz | 2020-08-25 |
| 10636746 | Method of forming an electronic package | Kamal K. Sikka, Krishna R. Tunga, Thomas Weiss, Shidong Li, Sushumna Iruvanti | 2020-04-28 |
| 10593564 | Lid attach optimization to limit electronic package warpage | Sushumna Iruvanti, Shidong Li, Kamal K. Sikka, Jeffrey A. Zitz | 2020-03-17 |
| 10566215 | Method of fabricating a chip module with stiffening frame and orthogonal heat spreader | Evan G. Colgan, Yi Pan, Jeffrey A. Zitz | 2020-02-18 |
| 10541156 | Multi integrated circuit chip carrier package | Marcus E. Interrante, Kathryn R. Lange, Kamal K. Sikka, Tuhin Sinha, Jeffrey A. Zitz | 2020-01-21 |
| 10542636 | Cooling structure for electronic boards | Paul F. Bodenweber, Kenneth C. Marston, Kamal K. Sikka, Randall J. Werner, Jeffrey A. Zitz | 2020-01-21 |
| 10424494 | Chip module with stiffening frame and orthogonal heat spreader | Evan G. Colgan, Yi Pan, Jeffrey A. Zitz | 2019-09-24 |
| 10424527 | Electronic package with tapered pedestal | Kamal K. Sikka, Krishna R. Tunga, Thomas Weiss | 2019-09-24 |
| 10332813 | Lid attach optimization to limit electronic package warpage | Sushumna Iruvanti, Shidong Li, Kamal K. Sikka, Jeffrey A. Zitz | 2019-06-25 |
| 10172258 | Cooling structure for electronic boards | Paul F. Bodenweber, Kenneth C. Marston, Kamal K. Sikka, Randall J. Werner, Jeffrey A. Zitz | 2019-01-01 |
| 10128590 | Pluggable LGA socket for high density interconnects | Alan F. Benner, Benjamin V. Fasano, Paul F. Fortier | 2018-11-13 |
| 10090173 | Method of fabricating a chip module with stiffening frame and directional heat spreader | Evan G. Colgan, Yi Pan, Jeffrey A. Zitz | 2018-10-02 |
| 10083886 | Lid attach optimization to limit electronic package warpage | Sushumna Iruvanti, Shidong Li, Kamal K. Sikka, Jeffrey A. Zitz | 2018-09-25 |
| 10049896 | Lid attach optimization to limit electronic package warpage | Sushumna Iruvanti, Shidong Li, Kamal K. Sikka, Jeffrey A. Zitz | 2018-08-14 |
| 9947603 | Lid attach optimization to limit electronic package warpage | Sushumna Iruvanti, Shidong Li, Kamal K. Sikka, Jeffrey A. Zitz | 2018-04-17 |
| 9721870 | Cooling structure for electronic boards | Paul F. Bodenweber, Kenneth C. Marston, Kamal K. Sikka, Randall J. Werner, Jeffrey A. Zitz | 2017-08-01 |