| 10446442 |
Integrated circuit chip with molding compound handler substrate and method |
Shahid Butt |
2019-10-15 |
| 10090255 |
Dicing channels for glass interposers |
Brittany L. Hedrick, Vijay Sukumaran, Richard F. Indyk, Sarah H. Knickerbocker |
2018-10-02 |
| 9754823 |
Substrate including selectively formed barrier layer |
Yuri M. Brovman, Brian M. Erwin, Nicholas A. Polomoff, Jennifer D. Schuler, Matthew E. Souter |
2017-09-05 |
| 9748135 |
Substrate including selectively formed barrier layer |
Yuri M. Brovman, Brian M. Erwin, Nicholas A. Polomoff, Jennifer D. Schuler, Matthew E. Souter |
2017-08-29 |
| 9278401 |
Fill head interface with combination vacuum pressure chamber |
Glen N. Biggs, Russell A. Budd, Benjamin V. Fasano, John J. Garant, Peter A. Gruber +5 more |
2016-03-08 |
| 9254533 |
Removing material from defective opening in glass mold |
Jerome D. Cohen, Robert Haas, Enrico Herz, Michael Teich |
2016-02-09 |
| 8800952 |
Removing material from defective opening in glass mold and related glass mold for injection molded solder |
Jerome D. Cohen, Robert Haas, Enrico Herz, Michael Teich |
2014-08-12 |
| 8237086 |
Removing material from defective opening in glass mold |
Jerome D. Cohen, Robert Haas, Enrico Herz, Michael Teich |
2012-08-07 |
| 8123088 |
Dispensing assembly with a controlled gas environment |
Glen N. Biggs, Russell A. Budd, Benjamin V. Fasano, John J. Garant, John P. Karidis +1 more |
2012-02-28 |
| 8123089 |
Dispensing assembly with an injector controlled gas environment |
Glen N. Biggs, Russell A. Budd, Benjamin V. Fasano, John J. Garant, G. Gerard Gormley +2 more |
2012-02-28 |
| 7833897 |
Process for making interconnect solder Pb-free bumps free from organo-tin/tin deposits on the wafer surface |
Sarah H. Knickerbocker, Sean A. Allen, John J. Garant, Jerry A. Gorrell, Phillip W. Palmatier |
2010-11-16 |
| 7513410 |
Air bearing gap control for injection molded solder heads |
Glen N. Biggs, Timothy J. Chainer, John P. Karidis, Dennis G. Manzer |
2009-04-07 |
| 7401637 |
Pressure-only molten metal valving apparatus and method |
Glen N. Biggs, John J. Garant, Peter A. Gruber, Bouwe W. Leenstra, Thomas Weiss |
2008-07-22 |
| 7332424 |
Fluxless solder transfer and reflow process |
Luc Belanger, Peter A. Gruber, Valerie Oberson |
2008-02-19 |
| 6973715 |
Method of forming a multichip module having chips on two sides |
Ajay P. Giri, Joseph M. Sullivan |
2005-12-13 |
| 6892781 |
Method and apparatus for application of pressure to a workpiece by thermal expansion |
Dale Curtis McHerron, Kaushal S. Patel, Jerry A. Gorrell, James Edward Tersigni |
2005-05-17 |
| 6765152 |
Multichip module having chips on two sides |
Ajay P. Giri, Joseph M. Sullivan |
2004-07-20 |
| 6413868 |
Modular high frequency integrated circuit structure |
Thomas A. Bartush, David L. Harame, John C. Malinowski, Dawn Tudryn Piciacchio, Richard P. Volant |
2002-07-02 |
| 6259148 |
Modular high frequency integrated circuit structure |
Thomas A. Bartush, David L. Harame, John C. Malinowski, Dawn Tudryn Piciacchio, Richard P. Volant |
2001-07-10 |
| 5905566 |
Laser ablation top surface reference chuck |
Ralph R. Comulada, Jr., Bouwe W. Leenstra |
1999-05-18 |
| 5609778 |
Process for high contrast marking on surfaces using lasers |
Doris Pulaski, Richard Anderson, Stephen J. Tirch, III, Dawn J. Tudryn |
1997-03-11 |
