Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11699640 | Power semiconductor module for PCB embedding, power electronic assembly having a power module embedded in a PCB, and corresponding methods of production | Thomas Stoek, Frank Daeche | 2023-07-11 |
| 11587800 | Semiconductor package with lead tip inspection feature | Chau Fatt Chiang, Khay Chwan Saw | 2023-02-21 |
| 11515244 | Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufacture | Bun Kian Tay, Mei Yih Goh, Martin Gruber, Josef Hoeglauer, Michael Juerss +3 more | 2022-11-29 |
| 11302613 | Double-sided cooled molded semiconductor package | Chau Fatt Chiang, Swee Kah Lee, Josef Maerz, Thomas Stoek | 2022-04-12 |
| 11211356 | Power semiconductor package and method for fabricating a power semiconductor package | Wee Aun Jason Lim, Paul Armand Asentista Calo, Ting Soon Chin, Chooi Mei Chong, Sanjay Kumar Murugan +1 more | 2021-12-28 |
| 10886199 | Molded semiconductor package with double-sided cooling | Chau Fatt Chiang, Swee Kah Lee, Josef Maerz, Thomas Stoek | 2021-01-05 |
| 10037934 | Semiconductor chip package having contact pins at short side edges | Ralf Otremba, Chooi Mei Chong, Raynold Talavera Corocotchia, Teck Sim Lee, Sanjay Kumar Murugan +2 more | 2018-07-31 |
| 9478484 | Semiconductor packages and methods of formation thereof | Ralf Otremba, Klaus Schiess | 2016-10-25 |
| 9263421 | Semiconductor device having multiple chips mounted to a carrier | Boon Seong Lee | 2016-02-16 |
| 9111772 | Electronic array and chip package | Volker Strutz, Horst Theuss, Hui Teng Wang | 2015-08-18 |
| 8664753 | Semiconductor device with protruding component portion and method of packaging | Teck Sim Lee, Kwai Hong Wong | 2014-03-04 |