Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6931726 | Method of making and interconnect structure | Donald S. Farquhar, Konstantinos I. Papathomas | 2005-08-23 |
| 6775907 | Process for manufacturing a printed wiring board | Robert Jeffrey Day, Kristen A. Stauffer | 2004-08-17 |
| 6776852 | Process of removing holefill residue from a metallic surface of an electronic substrate | Brian E. Curcio, Donald S. Farquhar, Michael Wozniak | 2004-08-17 |
| 6660945 | Interconnect structure and method of making same | Donald S. Farquhar, Konstantinos I. Papathomas | 2003-12-09 |
| 6547974 | Method of producing fine-line circuit boards using chemical polishing | Stanley M. Albrechta, Kathleen L. Covert, Natalie B. Feilchenfeld, Voya R. Markovich, William E. Wilson +1 more | 2003-04-15 |
| 6212769 | Process for manufacturing a printed wiring board | Robert Jeffrey Day, Kristen A. Stauffer | 2001-04-10 |
| 6214525 | Printed circuit board with circuitized cavity and methods of producing same | Donald S. Farquhar, Robert M. Japp, Michael Joseph Klodowski | 2001-04-10 |
| 6194024 | Via fill compositions for direct attach of devices and methods for applying same | Roy Lynn Arldt, Burtran Joe Cayson, Richard Michael Kozlowski, Joseph Duane Kulesza, John M. Lauffer +7 more | 2001-02-27 |
| 6134772 | Via fill compositions for direct attach of devices and methods of applying same | Roy Lynn Arldt, Burtran Joe Cayson, Richard Michael Kozlowski, Joseph Duane Kulesza, John M. Lauffer +7 more | 2000-10-24 |
| 6121069 | Interconnect structure for joining a chip to a circuit card | Anthony P. Ingraham, Voya R. Markovich, David J. Russell | 2000-09-19 |
| 6066386 | Printed circuit board with cavity for circuitization | Donald S. Farquhar, Robert M. Japp, Michael Joseph Klodowski | 2000-05-23 |
| 6030693 | Method for producing multi-layer circuit board and resulting article of manufacture | John M. Lauffer, Ronnie Charles McHatton, Issa S. Mahmoud | 2000-02-29 |
| 6015520 | Method for filling holes in printed wiring boards | Bernd Karl Appelt, Donald S. Farquhar, Stephen Joseph Fuerniss, Michael Joseph Klodowski | 2000-01-18 |
| 5953623 | Ball limiting metal mask and tin enrichment of high melting point solder for low temperature interconnection | Anthony P. Ingraham, Voya R. Markovich, David J. Russell | 1999-09-14 |
| 5830374 | Method for producing multi-layer circuit board and resulting article of manufacture | John M. Lauffer, Ronnie Charles McHatton, Issa S. Mahmoud | 1998-11-03 |
| 5784782 | Method for fabricating printed circuit boards with cavities | Donald S. Farquhar, Robert M. Japp, Michael Joseph Klodowski | 1998-07-28 |
| 5766670 | Via fill compositions for direct attach of devices and methods for applying same | Roy Lynn Arldt, Burtran Joe Cayson, Richard Michael Kozlowski, Joseph Duane Kulesza, John M. Lauffer +7 more | 1998-06-16 |
| 5571593 | Via fill compositions for direct attach of devices and methods for applying same | Roy Lynn Arldt, Burtran Joe Cayson, Richard Michael Kozlowski, Joseph Duane Kulesza, John M. Lauffer +7 more | 1996-11-05 |
| 5472735 | Method for forming electrical connection to the inner layers of a multilayer circuit board | Richard W. Carpenter, Raymond T. Galasco, Krystyna W. Semkow, Herbert Wegener | 1995-12-05 |
| 5450290 | Printed circuit board with aligned connections and method of making same | Francis J. Bucek, Richard W. Carpenter, Voya R. Markovich, Darleen Mayo, Cindy M. Reidsema +1 more | 1995-09-12 |
| 5374338 | Selective electroetch of copper and other metals | Richard W. Carpenter, Raymond T. Galasco, Krystyna W. Semkow, Herbert Wegener | 1994-12-20 |
| 4960634 | Epoxy composition of increased thermal conductivity and use thereof | Craig N. Johnston, James R. Loomis, Carl Samuelson, Ricahrd A. Schumacher | 1990-10-02 |