Issued Patents All Time
Showing 176–200 of 206 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9583426 | Multi-layer substrates suitable for interconnection between circuit modules | Hong Shen, Liang Wang, Gabriel Z. Guevara, Cyprian Emeka Uzoh, Laura Wills Mirkarimi | 2017-02-28 |
| 9583456 | Multiple bond via arrays of different wire heights on a same substrate | Cyprian Emeka Uzoh | 2017-02-28 |
| 9548273 | Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assemblies | Guilian Gao, Cyprian Emeka Uzoh, Charles G. Woychik, Hong Shen, Arkalgud R. Sitaram +2 more | 2017-01-17 |
| 9543277 | Wafer level packages with mechanically decoupled fan-in and fan-out areas | Bongsub Lee, Tu Tam Vu, Laura Wills Mirkarimi, Akash Agrawal, Kyong-Mo Bang +3 more | 2017-01-10 |
| 9524883 | Holding of interposers and other microelectronic workpieces in position during assembly and other processing | Charles G. Woychik, Eric Tosaya | 2016-12-20 |
| 9508691 | Flipped die stacks with multiple rows of leadframe interconnects | Javier A. Delacruz, Belgacem Haba, Tu Tam Vu | 2016-11-29 |
| 9508638 | Making electrical components in handle wafers of integrated circuit packages | Liang Wang, Hong Shen | 2016-11-29 |
| 9502372 | Wafer-level packaging using wire bond wires in place of a redistribution layer | Tu Tam Vu, Bongsub Lee, Kyong-Mo Bang, Xuan Li, Long Huynh +4 more | 2016-11-22 |
| 9496236 | Interconnect structure | Debabrata Gupta, Yukio Hashimoto, Ilyas Mohammed, Laura Wills Mirkarimi | 2016-11-15 |
| 9496154 | Use of underfill tape in microelectronic components, and microelectronic components with cavities coupled to through-substrate vias | Eric Tosaya, Liang Wang, Cyprian Emeka Uzoh | 2016-11-15 |
| 9490195 | Wafer-level flipped die stacks with leadframes or metal foil interconnects | Ashok S. Prabhu, Sean MORAN | 2016-11-08 |
| 9478504 | Microelectronic assemblies with cavities, and methods of fabrication | Hong Shen, Liang Wang, Charles G. Woychik, Guilian Gao | 2016-10-25 |
| 9455237 | Bowl-shaped solder structure | Cyprian Emeka Uzoh | 2016-09-27 |
| 9437566 | Conductive connections, structures with such connections, and methods of manufacture | Cyprian Emeka Uzoh | 2016-09-06 |
| 9437536 | Reversed build-up substrate for 2.5D | Liang Wang, Hong Shen, Cyprian Emeka Uzoh, Belgacem Haba | 2016-09-06 |
| 9412714 | Wire bond support structure and microelectronic package including wire bonds therefrom | Reynaldo Co, Wael Zohni, Rizza Lee Saga Cizek | 2016-08-09 |
| 9412806 | Making multilayer 3D capacitors using arrays of upstanding rods or ridges | Liang Wang, Hong Shen, Cyprian Emeka Uzoh | 2016-08-09 |
| 9379074 | Die stacks with one or more bond via arrays of wire bond wires and with one or more arrays of bump interconnects | Cyprian Emeka Uzoh | 2016-06-28 |
| 9373585 | Polymer member based interconnect | Cyprian Emeka Uzoh, Charles G. Woychik, Guilian Gao, Arkalgud R. Sitaram | 2016-06-21 |
| 9368479 | Thermal vias disposed in a substrate proximate to a well thereof | Arkalgud R. Sitaram, Cyprian Emeka Uzoh | 2016-06-14 |
| 9355997 | Integrated circuit assemblies with reinforcement frames, and methods of manufacture | Laura Wills Mirkarimi, Arkalgud R. Sitaram, Charles G. Woychik | 2016-05-31 |
| 9349614 | Device and method for localized underfill | Liang Wang, Charles G. Woychik, Cyprian Emeka Uzoh | 2016-05-24 |
| 9331043 | Localized sealing of interconnect structures in small gaps | Cyprian Emeka Uzoh, Arkalgud R. Sitaram | 2016-05-03 |
| 9324626 | Interposers with circuit modules encapsulated by moldable material in a cavity, and methods of fabrication | Hong Shen, Liang Wang | 2016-04-26 |
| 9263394 | Multiple bond via arrays of different wire heights on a same substrate | Cyprian Emeka Uzoh | 2016-02-16 |