Issued Patents All Time
Showing 201–206 of 206 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9226396 | Porous alumina templates for electronic packages | Cyprian Emeka Uzoh, Belgacem Haba, Ilyas Mohammed | 2015-12-29 |
| 9165793 | Making electrical components in handle wafers of integrated circuit packages | Liang Wang, Hong Shen | 2015-10-20 |
| 9076594 | Capacitors using porous alumina structures | Cyprian Emeka Uzoh | 2015-07-07 |
| 9070676 | Bowl-shaped solder structure | Cyprian Emeka Uzoh | 2015-06-30 |
| 8978247 | TSV fabrication using a removable handling structure | Se Young Yang, Cyprian Emeka Uzoh, Michael Van Huynh | 2015-03-17 |
| 8853558 | Interconnect structure | Debabrata Gupta, Yukio Hashimoto, Ilyas Mohammed, Laura Wills Mirkarimi | 2014-10-07 |