Issued Patents All Time
Showing 126–150 of 206 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10181457 | Microelectronic package for wafer-level chip scale packaging with fan-out | Ashok S. Prabhu | 2019-01-15 |
| 10163833 | Multichip modules and methods of fabrication | Liang Wang, Hong Shen | 2018-12-25 |
| 10159148 | Porous alumina templates for electronic packages | Cyprian Emeka Uzoh, Belgacem Haba, Ilyas Mohammed | 2018-12-18 |
| 10147548 | Capacitors using porous alumina structures | Cyprian Emeka Uzoh | 2018-12-04 |
| 10103121 | Tall and fine pitch interconnects | Cyprian Emeka Uzoh | 2018-10-16 |
| 10090231 | Conductive connections, structures with such connections, and methods of manufacture | Cyprian Emeka Uzoh | 2018-10-02 |
| 10049998 | Conductive connections, structures with such connections, and methods of manufacture | Cyprian Emeka Uzoh | 2018-08-14 |
| 10043779 | Packaged microelectronic device for a package-on-package device | Ashok S. Prabhu | 2018-08-07 |
| 10032647 | Low CTE component with wire bond interconnects | Cyprian Emeka Uzoh | 2018-07-24 |
| 10026717 | Multiple bond via arrays of different wire heights on a same substrate | Cyprian Emeka Uzoh | 2018-07-17 |
| 10014243 | Interconnection substrates for interconnection between circuit modules, and methods of manufacture | Hong Shen, Liang Wang, Gabriel Z. Guevara, Cyprian Emeka Uzoh, Laura Wills Mirkarimi | 2018-07-03 |
| 10008469 | Wafer-level packaging using wire bond wires in place of a redistribution layer | Tu Tam Vu, Bongsub Lee, Kyong-Mo Bang, Xuan Li, Long Huynh +4 more | 2018-06-26 |
| 10008534 | Microelectronic package with horizontal and vertical interconnections | Cyprian Emeka Uzoh | 2018-06-26 |
| 10002844 | Bonded structures | Liang Wang, Javier A. Delacruz, Arkalgud R. Sitaram | 2018-06-19 |
| 9947641 | Wire bond support structure and microelectronic package including wire bonds therefrom | Reynaldo Co, Wael Zohni, Rizza Lee Saga Cizek | 2018-04-17 |
| 9911718 | ‘RDL-First’ packaged microelectronic device for a package-on-package device | Ashok S. Prabhu | 2018-03-06 |
| 9899442 | Image sensor device | — | 2018-02-20 |
| 9888584 | Contact structures with porous networks for solder connections, and methods of fabricating same | Liang Wang, Hong Shen, Cyprian Emeka Uzoh | 2018-02-06 |
| 9887166 | Integrated circuit assemblies with reinforcement frames, and methods of manufacture | Laura Wills Mirkarimi, Arkalgud R. Sitaram, Charles G. Woychik | 2018-02-06 |
| 9871019 | Flipped die stack assemblies with leadframe interconnects | Ashok S. Prabhu, Liang Wang, Cyprian Emeka Uzoh | 2018-01-16 |
| 9865675 | Making multilayer 3D capacitors using arrays of upstanding rods or ridges | Liang Wang, Hong Shen, Cyprian Emeka Uzoh | 2018-01-09 |
| 9865548 | Polymer member based interconnect | Cyprian Emeka Uzoh, Charles G. Woychik, Guilian Gao, Arkalgud R. Sitaram | 2018-01-09 |
| 9859257 | Flipped die stacks with multiple rows of leadframe interconnects | Javier A. Delacruz, Belgacem Haba, Tu Tam Vu | 2018-01-02 |
| 9852969 | Die stacks with one or more bond via arrays of wire bond wires and with one or more arrays of bump interconnects | Cyprian Emeka Uzoh | 2017-12-26 |
| 9847238 | Fan-out wafer-level packaging using metal foil lamination | Xuan Li, Long Huynh, Laura Wills Mirkarimi, Bongsub Lee, Gabriel Z. Guevara +3 more | 2017-12-19 |