Issued Patents All Time
Showing 101–125 of 206 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10802285 | Remote optical engine for virtual reality or augmented reality headsets | Belgacem Haba, Ilyas Mohammed | 2020-10-13 |
| 10790262 | Low temperature bonded structures | Cyprian Emeka Uzoh, Jeremy Alfred Theil, Liang Wang, Guilian Gao, Laura Wills Mirkarimi | 2020-09-29 |
| 10784282 | 3D NAND—high aspect ratio strings and channels | Xu Chang, Belgacem Haba | 2020-09-22 |
| 10658313 | Selective recess | Javier A. Delacruz, Shaowu Huang, Gaius Gillman Fountain, Jr., Liang Wang, Laura Wills Mirkarimi | 2020-05-19 |
| 10629577 | Direct-bonded LED arrays and applications | Min Tao, Liang Wang, Cyprian Emeka Uzoh | 2020-04-21 |
| 10629567 | Multiple plated via arrays of different wire heights on same substrate | Cyprian Emeka Uzoh | 2020-04-21 |
| 10593563 | Fan-out wafer level package with resist vias | Belgacem Haba, Ilyas Mohammed | 2020-03-17 |
| 10586759 | Interconnection substrates for interconnection between circuit modules, and methods of manufacture | Hong Shen, Liang Wang, Gabriel Z. Guevara, Cyprian Emeka Uzoh, Laura Wills Mirkarimi | 2020-03-10 |
| 10546832 | Bonded structures | Liang Wang, Javier A. Delacruz, Arkalgud R. Sitaram | 2020-01-28 |
| 10546834 | Multi-chip modules formed using wafer-level processing of a reconstituted wafer | Liang Wang | 2020-01-28 |
| 10531574 | Contact structures with porous networks for solder connections, and methods of fabricating same | Liang Wang, Hong Shen, Cyprian Emeka Uzoh | 2020-01-07 |
| 10529636 | Fine pitch BVA using reconstituted wafer with area array accessible for testing | — | 2020-01-07 |
| 10522499 | Bonded structures | Paul M. Enquist, Liang Wang, Javier A. Delacruz, Arkalgud R. Sitaram | 2019-12-31 |
| 10515913 | Multi-metal contact structure | Cyprian Emeka Uzoh | 2019-12-24 |
| 10508030 | Seal for microelectronic assembly | Liang Wang, Cyprian Emeka Uzoh, Shaowu Huang, Guilian Gao, Ilyas Mohammed | 2019-12-17 |
| 10490520 | Multichip modules and methods of fabrication | Liang Wang, Hong Shen | 2019-11-26 |
| 10475726 | Low CTE component with wire bond interconnects | Cyprian Emeka Uzoh | 2019-11-12 |
| 10431648 | Making electrical components in handle wafers of integrated circuit packages | Liang Wang, Hong Shen | 2019-10-01 |
| 10410977 | High performance compliant substrate | Cyprian Emeka Uzoh | 2019-09-10 |
| 10354945 | Multi-surface edge pads for vertical mount packages and methods of making package stacks | Min Tao, Javier A. Delacruz, Hoki Kim, Akash Agrawal | 2019-07-16 |
| 10332854 | Anchoring structure of fine pitch bva | Gabriel Z. Guevara, Xuan Li, Cyprian Emeka Uzoh, Guilian Gao, Liang Wang | 2019-06-25 |
| 10290613 | Multiple bond via arrays of different wire heights on a same substrate | Cyprian Emeka Uzoh | 2019-05-14 |
| 10269853 | Image sensor device | — | 2019-04-23 |
| 10217720 | Multi-chip modules formed using wafer-level processing of a reconstitute wafer | Liang Wang | 2019-02-26 |
| 10204977 | Making electrical components in handle wafers of integrated circuit packages | Liang Wang, Hong Shen | 2019-02-12 |