Issued Patents All Time
Showing 51–75 of 206 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11830804 | Over and under interconnects | Belgacem Haba, Stephen L. Morein, Ilyas Mohammed, Javier A. Delacruz | 2023-11-28 |
| 11824046 | Symbiotic network on layers | Javier A. Delacruz, Belgacem Haba | 2023-11-21 |
| 11817409 | Directly bonded structures without intervening adhesive and methods for forming the same | Belgacem Haba, Ilyas Mohammed, Javier A. Delacruz | 2023-11-14 |
| 11804469 | Active bridging apparatus | Javier A. Delacruz, Belgacem Haba | 2023-10-31 |
| 11764189 | Molded direct bonded and interconnected stack | Guilian Gao, Cyprian Emeka Uzoh, Jeremy Alfred Theil, Belgacem Haba | 2023-09-19 |
| 11762200 | Bonded optical devices | Belgacem Haba | 2023-09-19 |
| 11749645 | TSV as pad | Guilian Gao, Bongsub Lee, Gaius Gillman Fountain, Jr., Cyprian Emeka Uzoh, Belgacem Haba +1 more | 2023-09-05 |
| 11728287 | Wafer-level bonding of obstructive elements | Javier A. Delacruz | 2023-08-15 |
| 11715730 | Direct-bonded LED arrays including optical elements configured to transmit optical signals from LED elements | Min Tao, Liang Wang, Cyprian Emeka Uzoh | 2023-08-01 |
| 11694925 | Diffusion barrier collar for interconnects | Cyprian Emeka Uzoh | 2023-07-04 |
| 11670615 | Bonded structures | Liang Wang, Javier A. Delacruz, Arkalgud R. Sitaram | 2023-06-06 |
| 11626363 | Bonded structures with integrated passive component | Belgacem Haba, Ilyas Mohammed, Gabriel Z. Guevara, Javier A. Delacruz, Shaowu Huang +1 more | 2023-04-11 |
| 11610846 | Protective elements for bonded structures including an obstructive element | Belgacem Haba, Javier A. Delacruz, Arkalgud R. Sitaram | 2023-03-21 |
| 11600542 | Cavity packages | Shaowu Huang, Javier A. Delacruz, Liang Wang, Belgacem Haba | 2023-03-07 |
| 11515279 | Low temperature bonded structures | Cyprian Emeka Uzoh, Jeremy Alfred Theil, Liang Wang, Guilian Gao, Laura Wills Mirkarimi | 2022-11-29 |
| 11476213 | Bonded structures without intervening adhesive | Belgacem Haba, Ilyas Mohammed, Javier A. Delacruz | 2022-10-18 |
| 11469214 | Stacked architecture for three-dimensional NAND | Stephen L. Morein, Javier A. Delacruz, Xu Chang, Belgacem Haba | 2022-10-11 |
| 11417576 | Seal for microelectronic assembly | Liang Wang, Cyprian Emeka Uzoh, Shaowu Huang, Guilian Gao, Ilyas Mohammed | 2022-08-16 |
| 11404439 | 3D NAND—high aspect ratio strings and channels | Xu Chang, Belgacem Haba | 2022-08-02 |
| 11404338 | Fine pitch bva using reconstituted wafer with area array accessible for testing | — | 2022-08-02 |
| 11393779 | Large metal pads over TSV | Guilian Gao, Bongsub Lee, Gaius Gillman Fountain, Jr., Cyprian Emeka Uzoh, Laura Wills Mirkarimi +1 more | 2022-07-19 |
| 11387214 | Multi-chip modules formed using wafer-level processing of a reconstituted wafer | Liang Wang | 2022-07-12 |
| 11380597 | Bonded structures | Liang Wang | 2022-07-05 |
| 11373963 | Protective elements for bonded structures | Javier A. Delacruz, Belgacem Haba | 2022-06-28 |
| 11348898 | Systems and methods for releveled bump planes for chiplets | Javier A. Delacruz, Belgacem Haba, Cyprian Emeka Uzoh, Ilyas Mohammed | 2022-05-31 |