Issued Patents All Time
Showing 26–50 of 206 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12153222 | Bonded optical devices | Belgacem Haba | 2024-11-26 |
| 12136605 | Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics and method for forming the same | Guilian Gao, Gaius Gillman Fountain, Jr., Laura Wills Mirkarimi, Ilyas Mohammed, Cyprian Emeka Uzoh | 2024-11-05 |
| 12132020 | Low temperature bonded structures | Cyprian Emeka Uzoh, Jeremy Alfred Theil, Guilian Gao, Laura Wills Mirkarimi | 2024-10-29 |
| 12100684 | Bonded structures | Liang Wang, Javier A. Delacruz, Arkalgud R. Sitaram | 2024-09-24 |
| 12100676 | Low temperature bonded structures | Cyprian Emeka Uzoh, Jeremy Alfred Theil, Guilian Gao, Laura Wills Mirkarimi | 2024-09-24 |
| 12080672 | Direct gang bonding methods including directly bonding first element to second element to form bonded structure without adhesive | Belgacem Haba, Laura Wills Mirkarimi, Javier A. Delacruz, Cyprian Emeka Uzoh, Guilian Gao +1 more | 2024-09-03 |
| 12057383 | Bonded structures with integrated passive component | Belgacem Haba, Ilyas Mohammed, Gabriel Z. Guevara, Javier A. Delacruz, Shaowu Huang +1 more | 2024-08-06 |
| 12046583 | Electrical redundancy for bonded structures | Belgacem Haba | 2024-07-23 |
| 12046571 | Low temperature bonded structures | Cyprian Emeka Uzoh, Jeremy Alfred Theil, Liang Wang, Guilian Gao, Laura Wills Mirkarimi | 2024-07-23 |
| 12035529 | 3D NAND—high aspect ratio strings and channels | Xu Chang, Belgacem Haba | 2024-07-09 |
| RE49987 | Multiple plated via arrays of different wire heights on a same substrate | Cyprian Emeka Uzoh | 2024-05-28 |
| 11990382 | Fine pitch BVA using reconstituted wafer with area array accessible for testing | — | 2024-05-21 |
| 11967575 | Bond enhancement structure in microelectronics for trapping contaminants during direct-bonding processes | Guilian Gao, Javier A. Delacruz, Shaowu Huang, Liang Wang, Gaius Gillman Fountain, Jr. +1 more | 2024-04-23 |
| 11955393 | Structures for bonding elements including conductive interface features | Laura Wills Mirkarimi, Bongsub Lee, Gaius Gillman Fountain, Jr., Cyprian Emeka Uzoh | 2024-04-09 |
| 11955463 | Direct bonded stack structures for increased reliability and improved yield in microelectronics | Cyprian Emeka Uzoh, Thomas Workman, Guilian Gao, Gaius Gillman Fountain, Jr., Laura Wills Mirkarimi +3 more | 2024-04-09 |
| 11955445 | Metal pads over TSV | Guilian Gao, Bongsub Lee, Gaius Gillman Fountain, Jr., Cyprian Emeka Uzoh, Laura Wills Mirkarimi +1 more | 2024-04-09 |
| 11948847 | Bonded structures | Liang Wang | 2024-04-02 |
| 11935907 | Image sensor device | — | 2024-03-19 |
| 11914148 | Stacked optical waveguides | Ilyas Mohammed, Belgacem Haba | 2024-02-27 |
| 11894326 | Multi-metal contact structure | Cyprian Emeka Uzoh | 2024-02-06 |
| 11876076 | Apparatus for non-volatile random access memory stacks | Javier A. Delacruz, Belgacem Haba, Pearl Po-Yee Cheng | 2024-01-16 |
| 11862604 | Systems and methods for releveled bump planes for chiplets | Javier A. Delacruz, Belgacem Haba, Cyprian Emeka Uzoh, Ilyas Mohammed | 2024-01-02 |
| 11848284 | Protective elements for bonded structures | Javier A. Delacruz, Belgacem Haba | 2023-12-19 |
| 11842894 | Electrical redundancy for bonded structures | Belgacem Haba | 2023-12-12 |
| 11837582 | Molded direct bonded and interconnected stack | Guilian Gao, Cyprian Emeka Uzoh, Jeremy Alfred Theil, Belgacem Haba | 2023-12-05 |