Issued Patents All Time
Showing 26–50 of 95 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8991711 | Chip card module | Frank Pueschner, Juergen Hoegerl, Wolfgang Schindler | 2015-03-31 |
| 8952489 | Semiconductor package and method for fabricating the same | Klaus Elian, Horst Theuss, Renate Hofmann, Alexander Glas, Carsten Ahrens | 2015-02-10 |
| 8889548 | On-chip RF shields with backside redistribution lines | Hans-Joachim Barth, Gottfried Beer, Heinrich Koerner | 2014-11-18 |
| 8829663 | Stackable semiconductor package with encapsulant and electrically conductive feed-through | Markus Brunnbauer, Irmgard Escher-Poeppel, Thorsten Meyer | 2014-09-09 |
| 8786085 | Semiconductor structure and method for making same | Hans-Joachim Barth, Mathias Vaupel, Rainer Steiner, Werner Robl, Joern Plagmann +1 more | 2014-07-22 |
| 8779563 | Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chips | Markus Brunnbauer, Thorsten Meyer, Stephan Brandl, Ralf Plieninger, Klaus Pressel +1 more | 2014-07-15 |
| 8759207 | Semiconductor structure and method for making same | Hans-Joachim Barth, Mathias Vaupel, Rainer Steiner, Werner Robl, Joem Plagmann +1 more | 2014-06-24 |
| 8659135 | Semiconductor device stack and method for its production | Michael Bauer, Ulrich Bachmaier, Robert-Christian Hagen, Rainer Steiner, Hermann Vllsmeler +2 more | 2014-02-25 |
| 8659154 | Semiconductor device including adhesive covered element | Thorsten Meyer | 2014-02-25 |
| 8604622 | Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device | Thorsten Meyer, Markus Brunnbauer | 2013-12-10 |
| 8334202 | Device fabricated using an electroplating process | Hans-Joachim Barth, Gottfried Beer, Rainer Steiner, Werner Robl, Mathias Vaupel | 2012-12-18 |
| 8330273 | Semiconductor device including molding compound layer forms a common plane with the surface of the semiconductor chip | Markus Brunnbauer, Rainer Steiner | 2012-12-11 |
| 8330274 | Semiconductor structure and method for making same | Hans-Joachim Barth, Gottfried Beer, Joern Plagmann, Werner Robl, Rainer Steiner +1 more | 2012-12-11 |
| 8309454 | Structure for electrostatic discharge in embedded wafer level packages | Markus Brunnbauer, Thorsten Meyer, Stephan Bradl, Ralf Plieninger, Klaus Pressel +1 more | 2012-11-13 |
| 8202763 | Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device | Thorsten Meyer, Markus Brunnbauer | 2012-06-19 |
| 8169059 | On-chip RF shields with through substrate conductors | Hans-Joachim Barth, Gottfried Beer, Oliver Nagy | 2012-05-01 |
| 8148257 | Semiconductor structure and method for making same | Hans-Joachim Barth, Gottfried Beer, Joern Plagmann, Werner Robl, Rainer Steiner +1 more | 2012-04-03 |
| 8080880 | Semiconductor device with arrangement of parallel conductor lines being insulated, between and orthogonal to external contact pads | Markus Brunnbauer, Thorsten Meyer | 2011-12-20 |
| 8071428 | Semiconductor device | Markus Brunnbauer, Irmgard Escher-Poeppel, Thorsten Meyer | 2011-12-06 |
| 8072071 | Semiconductor device including conductive element | Rainer Steiner, Werner Robl, Markus Brunnbauer, Gottfried Beer | 2011-12-06 |
| 7993969 | Method for producing a module with components stacked one above another | Michael Bauer | 2011-08-09 |
| 7948071 | Integrated circuit with re-route layer and stacked die assembly | Jochen Thomas, Peter Weitz, Jurgen Grafe, Harry Hedler | 2011-05-24 |
| 7943423 | Reconfigured wafer alignment | Edward Fuergut, Markus Brunnbauer, Thorsten Meyer, Peter Strobel, Daniel Porwol +1 more | 2011-05-17 |
| 7936052 | On-chip RF shields with backside redistribution lines | Hans-Joachim Barth, Gottfried Beer, Heinrich Koerner | 2011-05-03 |
| 7919857 | Plastic housing and semiconductor component with said plastic housing | Michael Bauer, Peter Strobel, Christian Stuempfl, Ludwig Heitzer | 2011-04-05 |