Issued Patents All Time
Showing 51–75 of 95 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7863088 | Semiconductor device including covering a semiconductor with a molding compound and forming a through hole in the molding compound | Markus Brunnbauer, Rainer Steiner | 2011-01-04 |
| 7834464 | Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device | Thorsten Meyer, Markus Brunnbauer | 2010-11-16 |
| 7786584 | Through substrate via semiconductor components | Hans-Joachim Barth | 2010-08-31 |
| 7772105 | Semiconductor component with plastic housing, and process for producing the same | Ulrich Bachmaier, Michael Bauer, Robert-Christian Hagen, Rainer Steiner, Peter Strobel +3 more | 2010-08-10 |
| 7755178 | Base semiconductor component for a semiconductor component stack and method for the production thereof | Robert-Christian Hagen | 2010-07-13 |
| 7749864 | Semiconductor device with a thinned semiconductor chip and method for producing the thinned semiconductor chip | Michael Bauer, Ludwig Heitzer, Peter Strobel, Christian Stuempfl | 2010-07-06 |
| 7700956 | Sensor component and panel used for the production thereof | Edward Fuergut, Bernd Goller, Robert-Christian Hagen, Simon Jerebic, Peter Strobel +1 more | 2010-04-20 |
| 7687895 | Workpiece with semiconductor chips and molding, semiconductor device and method for producing a workpiece with semiconductors chips | Markus Brunnbauer, Klaus Pressel, Thorsten Meyer, Recai Sezi, Stephan Bradl +1 more | 2010-03-30 |
| 7666777 | Electronic structure with components connected by way of solderable connecting elements and method | Michael Bauer, Markus Brunnbauer, Irmgard Escher-Poeppel, Christian Stuempfl | 2010-02-23 |
| 7662664 | Electronic circuit in a package-on-package configuration and method for producing the same | Michael Bauer, Ludwig Heitzer, Peter Strobel, Christian Stuempfl | 2010-02-16 |
| 7663223 | Coupling substrate for semiconductor components and method for producing the same | — | 2010-02-16 |
| 7656018 | Package for an electronic component and method for its production | Michael Bauer | 2010-02-02 |
| 7592236 | Method for applying a structure of joining material to the back surfaces of semiconductor chips | Michael Bauer, Ludwig Heitzer, Peter Strobel, Christian Stuempfl | 2009-09-22 |
| 7575173 | Smart card, smart card module, and a method for production of a smart card module | Edward Fuergut, Bernd Goller, Robert-Christian Hagen, Simon Jerebic, Peter Strobel +1 more | 2009-08-18 |
| 7547645 | Method for coating a structure comprising semiconductor chips | Michael Bauer, Ludwig Heitzer, Peter Strobel, Christian Stuempfl | 2009-06-16 |
| 7524699 | Electronic component and a panel | Edward Fuergut, Bernd Goller, Robert-Christian Hagen, Simon Jerebic, Peter Strobel +1 more | 2009-04-28 |
| 7521809 | Semiconductor device having a chip stack on a rewiring plate | Christian Birzer | 2009-04-21 |
| 7514273 | Method for applying rewiring to a panel while compensating for position errors of semiconductor chips in component positions of the panel | Harry Hedler, Holger Woerner | 2009-04-07 |
| 7500305 | Placement system for populating a substrate with electronic components | Jürgen Högerl, Uta Sasse, Ingo Wennemuth | 2009-03-10 |
| 7456495 | Semiconductor module with a semiconductor stack, and methods for its production | Bernd Roemer, Bernhard Schaetzler, Christian Stuempfl, Herman Vilsmeier, Holger Woerner +1 more | 2008-11-25 |
| 7422930 | Integrated circuit with re-route layer and stacked die assembly | Jochen Thomas, Peter Weitz, Jurgen Grafe, Harry Hedler | 2008-09-09 |
| 7397111 | Semiconductor wafer, an electronic component, and a component carrier for producing the electronic component | Simon Jerebic, Horst Theuss | 2008-07-08 |
| 7391103 | Electronic module having plug contacts and method for producing it | Edward Fuergut, Bernd Goller, Robert-Christian Hagen, Simon Jerebic, Holger Woerner +1 more | 2008-06-24 |
| 7327023 | Semiconductor component with plastic housing, and process for producing the same | Ulrich Bachmaier, Michael Bauer, Robert-Christian Hagen, Rainer Steiner, Peter Strobel +3 more | 2008-02-05 |
| 7312533 | Electronic component with flexible contacting pads and method for producing the electronic component | Alfred Haimerl, Harry Hedler | 2007-12-25 |