Issued Patents All Time
Showing 76–95 of 95 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7294916 | Semiconductor device with a thinned semiconductor chip and method for producing the thinned semiconductor chip | Michael Bauer, Ludwig Heitzer, Peter Strobel, Christian Stuempfl | 2007-11-13 |
| 7208827 | Encasing arrangement for a semiconductor component | Christian Hauser, Simon Muff, Friedrich Wanninger | 2007-04-24 |
| 7069647 | Method for populating a substrate with electronic components | Jürgen Högerl, Uta Sasse, Ingo Wennemuth | 2006-07-04 |
| 6979591 | Connection of integrated circuits | Harry Hedler, Roland Irsigler | 2005-12-27 |
| 6897568 | Electronic component with flexible contacting pads and method for producing the electronic component | Alfred Haimerl, Harry Hedler | 2005-05-24 |
| 6897088 | Method for connecting circuit devices | Harry Hedler, Roland Irsigler | 2005-05-24 |
| 6798045 | Lead frame, circuit board with lead frame, and method for producing the lead frame | Simon Muff, Eckehard Miersch | 2004-09-28 |
| 6757171 | Device for fixing a heat distribution covering on a printed circuit board with heat distribution covering | Monika Bauer | 2004-06-29 |
| 6534345 | Method for mounting a semiconductor chip on a carrier layer and device for carrying out the method | Simon Muff, Johann Winderl | 2003-03-18 |
| 6521988 | Device for packaging electronic components | Christian Hauser, Johann Winderl | 2003-02-18 |
| 6430809 | Method for bonding conductors, in particular beam leads | Monika Bauer, Klemens Ferstl, Johann Winderl | 2002-08-13 |
| 6434035 | Memory system | Ekkehard F. Miersch, Simon Muff | 2002-08-13 |
| 6377460 | Electronic circuit having a flexible intermediate layer between electronic components and a heat sink | Gerolf Thamm, Andreas Hippe | 2002-04-23 |
| 6364751 | Method for singling semiconductor components and semiconductor component singling device | Oliver Wutz, Johann Winderl | 2002-04-02 |
| 6312962 | Method for COB mounting of electronic chips on a circuit board | Thomas Münch, Oliver Wutz | 2001-11-06 |
| 6144088 | Leadframe for semiconductor chips and semiconductor module having the lead frame | Michael Blumenauer, Ulrich Vidal | 2000-11-07 |
| 6104615 | Semiconductor component assembly | Simon Muff, Michael Schneider | 2000-08-15 |
| 6057595 | Integrated semiconductor circuit housing | Bruno Golz, Harald Widner | 2000-05-02 |
| 5576246 | Personalized area leadframe coining or half etching for reduced mechanical stress at device edge | Harold W. Conru, Francis E. Froebel, Albert J. Gregoritsch, Jr., Sheldon C. Rieley, Stephen G. Starr +2 more | 1996-11-19 |
| 5545921 | Personalized area leadframe coining or half etching for reduced mechanical stress at device edge | Harold W. Conru, Francis E. Froebel, Albert J. Gregoritsch, Jr., Sheldon C. Rieley, Stephen G. Starr +2 more | 1996-08-13 |