Issued Patents All Time
Showing 26–50 of 50 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7064064 | Copper recess process with application to selective capping and electroless plating | Shyng-Tsong Chen, Timothy J. Dalton, Kenneth M. Davis, Chao-Kun Hu, Fen F. Jamin +11 more | 2006-06-20 |
| 7022246 | Method of fabrication of MIMCAP and resistor at same level | Anil K. Chinthakindi, Shwu-Jen Jeng, Christopher M. Schnabel, Kenneth J. Stein | 2006-04-04 |
| 6975032 | Copper recess process with application to selective capping and electroless plating | Shyng-Tsong Chen, Timothy J. Dalton, Kenneth M. Davis, Chao-Kun Hu, Fen F. Jamin +11 more | 2005-12-13 |
| 6812193 | Slurry for mechanical polishing (CMP) of metals and use thereof | Michael T. Brigham, Donald F. Canaperi, Michael A. Cobb, William J. Cote, Kenneth M. Davis +9 more | 2004-11-02 |
| 6648979 | Apparatus and method for wafer cleaning | Marc Mattaroccia, Leonard C. Stevens, Jr. | 2003-11-18 |
| 6478665 | Multi-wafer polishing tool | — | 2002-11-12 |
| 6475072 | Method of wafer smoothing for bonding using chemo-mechanical polishing (CMP) | Donald F. Canaperi, Jack O. Chu, Guy M. Cohen, Lijuan Huang, John A. Ott | 2002-11-05 |
| 6348076 | Slurry for mechanical polishing (CMP) of metals and use thereof | Donald F. Canaperi, William J. Cote, Paul M. Feeney, Mahadevaiyer Krishnan, Joyce C. Liu +2 more | 2002-02-19 |
| 6344414 | Chemical-mechanical polishing system having a bi-material wafer backing film assembly | Kenneth M. Davis, Fen F. Jamin, Bradley P. Jones | 2002-02-05 |
| 6325696 | Piezo-actuated CMP carrier | Karl E. Boggs, Kenneth M. Davis, William Francis Landers, Adam D. Ticknor, Ronald D. Fiege | 2001-12-04 |
| 6267659 | Stacked polish pad | Shyng-Tsong Chen, Woody Smith | 2001-07-31 |
| 6228744 | Manufacturing methods and uses for micro pipe systems | Ernest N. Levine, James G. Ryan | 2001-05-08 |
| 6199269 | Manipulation of micromechanical objects | Nancy Anne Greco, Ernest N. Levine, James G. Ryan | 2001-03-13 |
| 6186877 | Multi-wafer polishing tool | — | 2001-02-13 |
| 6171513 | Chemical-mechanical polishing system having a bi-material wafer backing film and two-piece wafer carrier | Kenneth M. Davis, Ralph R. Comulada, Jr., Fen F. Jamin, Bradley P. Jones, Francis R. Krug, Jr. | 2001-01-09 |
| 6098788 | Casting of complex micromechanical objects | Nancy Anne Greco, Ernest N. Levine, James G. Ryan | 2000-08-08 |
| 6031286 | Semiconductor structures containing a micro pipe system therein | Ernest N. Levine, James G. Ryan | 2000-02-29 |
| 6030275 | Variable control of carrier curvature with direct feedback loop | — | 2000-02-29 |
| 6030487 | Wafer carrier assembly | Thomas R. Fisher, Jr., Carol E. Gustafson | 2000-02-29 |
| 6012968 | Apparatus for and method of conditioning chemical mechanical polishing pad during workpiece polishing cycle | — | 2000-01-11 |
| 5968841 | Device and method for preventing settlement of particles on a chemical-mechanical polishing pad | William Francis Landers, Adam D. Ticknor | 1999-10-19 |
| 5618354 | Apparatus and method for carrier backing film reconditioning | — | 1997-04-08 |
| 5609517 | Composite polishing pad | — | 1997-03-11 |
| 5558111 | Apparatus and method for carrier backing film reconditioning | — | 1996-09-24 |
| 5558563 | Method and apparatus for uniform polishing of a substrate | William J. Cote | 1996-09-24 |