Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12368013 | Thermal cut-off device for high power applications | Changcai ZHAO, Wei Shi, Kangsheng Lin, Guojun Xiao, Rong Guan +2 more | 2025-07-22 |
| D1011444 | Elephant toy | — | 2024-01-16 |
| 10313498 | Electronic device | Shou Ye, Lei Xiao, Gaoling Zhang, Yungchiang Lee, Xuan Wen +5 more | 2019-06-04 |
| 9475206 | Craft punch with replaceable cutting tool | — | 2016-10-25 |
| 9436100 | Exposure machine | Zhong LU, ByungChun Lee, Fujiang Jin | 2016-09-06 |
| 7786468 | Layer transfer of low defect SiGe using an etch-back process | Jack O. Chu, David R. DiMilia | 2010-08-31 |
| 7427773 | Layer transfer of low defect SiGe using an etch-back process | Jack O. Chu, David R. DiMilia | 2008-09-23 |
| 7145212 | Method for manufacturing device substrate with metal back-gate and structure formed thereby | Kevin K. Chan, Fenton R. McFeely, Paul M. Solomon, Hon-Sum Philip Wong | 2006-12-05 |
| 6890835 | Layer transfer of low defect SiGe using an etch-back process | Jack O. Chu, David R. DiMilia | 2005-05-10 |
| 6797604 | Method for manufacturing device substrate with metal back-gate and structure formed thereby | Kevin K. Chan, Fenton R. McFeely, Paul M. Solomon, Hon-Sum Philip Wong | 2004-09-28 |
| 6524935 | Preparation of strained Si/SiGe on insulator by hydrogen induced layer transfer technique | Donald F. Canaperi, Jack O. Chu, Christopher P. D'Emic, John A. Ott, Hon-Sum Philip Wong | 2003-02-25 |
| 6475072 | Method of wafer smoothing for bonding using chemo-mechanical polishing (CMP) | Donald F. Canaperi, Jack O. Chu, Guy M. Cohen, John A. Ott, Michael F. Lofaro | 2002-11-05 |