Issued Patents All Time
Showing 26–50 of 75 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6245171 | Multi-thickness, multi-layer green sheet lamination and method thereof | Govindarajan Natarajan, Abubaker S. Shagan | 2001-06-12 |
| 6228511 | Structure and process for thin film interconnect | Benedikt Maria Johannes Kellner, Kathleen Mary Mc Guire, Peter J. Sorce | 2001-05-08 |
| 6221269 | Method of etching molybdenum metal from substrates | Umar M. Ahmad, Hsing H. Chen, Lawrence D. David, Charles H. Perry, Donald R. Wall | 2001-04-24 |
| 6165629 | Structure for thin film interconnect | Benedikt Maria Johannes Kellner, Kathleen Mary McGuire, Peter J. Sorce | 2000-12-26 |
| 6114450 | Aryl Cyanate and/or diepoxide and tetrahydropyranyl-protected hydroxymethylated phenolic or hydroxystyrene resin | Michael Berger, Anson J. Call, Frank Louis Pompeo Jr. | 2000-09-05 |
| 6032683 | System for cleaning residual paste from a mask | Jon A. Casey, Michael E. Cropp, Donald W. DiAngelo, John F. Harmuth, John U. Knickerbocker +8 more | 2000-03-07 |
| 5976710 | Low TCE polyimides as improved insulator in multilayer interconnect structures | John P. Hummel, Sundar M. Kamath, Robert N. Lang, Anton Nendaic, Charles H. Perry +1 more | 1999-11-02 |
| 5955543 | Aryl cyanate and/or diepoxide and hydroxymethylated phenolic or hydroxystyrene resin | Michael Berger, Anson J. Call, Frank L. Pompeo | 1999-09-21 |
| 5938856 | Process of removing flux residue from microelectronic components | Umar M. Ahmad, John U. Knickerbocker, Chon Cheong Lei | 1999-08-17 |
| 5916374 | Optimized in-line mask cleaning system | Jon A. Casey, Michael E. Cropp, Donald W. DiAngelo, John F. Harmuth, John U. Knickerbocker +8 more | 1999-06-29 |
| 5888308 | Process for removing residue from screening masks with alkaline solution | John U. Knickerbocker, Glenn A. Pomerantz, Bruce E. Tripp | 1999-03-30 |
| 5773561 | Polymer sealants/adhesives and use thereof in electronic package assembly | Michael Berger, Patrick A. Coico, Frank L. Pompeo | 1998-06-30 |
| 5700581 | Solvent-free epoxy based adhesives for semiconductor chip attachment and process | Michael Berger, Mark S. Chace | 1997-12-23 |
| 5643818 | Removal of residues from metallic insert used in manufacture of multi-layer ceramic substrate with cavity for microelectronic chip | Thomas E. Lombardi, Vincent P. Peterson | 1997-07-01 |
| 5591789 | Polyester dispersants for high thermal conductivity paste | Sushumna Iruvanti, Keith Olsen | 1997-01-07 |
| 5532608 | Ceramic probe card and method for reducing leakage current | Abbas Behfar-Rad, Charles H. Perry | 1996-07-02 |
| 5470693 | Method of forming patterned polyimide films | Joel R. Whitaker, Umar M. Ahmad | 1995-11-28 |
| 5422223 | Silicon-containing positive resist and use in multilayer metal structures | Harbans S. Sachdev, Joel R. Whitaker | 1995-06-06 |
| 5399462 | Method of forming sub-half micron patterns with optical lithography using bilayer resist compositions comprising a photosensitive polysilsesquioxane | Premlatha Jagannathan, Robert N. Lang, Harbans S. Sachdev, Ratnam Sooriyakumaran, Joel R. Whitaker | 1995-03-21 |
| 5374503 | Method of forming patterned polyimide films | Joel R. Whitaker, Umar M. Ahmad | 1994-12-20 |
| 5310863 | Polyimide materials with improved physico-chemical properties | — | 1994-05-10 |
| 5303862 | Single step electrical/mechanical connection process for connecting I/O pins and creating multilayer structures | Arthur Bross, James J. Hedrick, Robert D. Johnson, Robert O. Lussow, James R. Lyerla, Jr. +3 more | 1994-04-19 |
| 5231751 | Process for thin film interconnect | Benedikt Maria Johannes Kellner, Kathleen Mary McGuire, Peter J. Sorce | 1993-08-03 |
| 5114826 | Photosensitive polyimide compositions | Ranee W. Kwong, Harbans S. Sachdev | 1992-05-19 |
| 5115090 | Viscosity stable, essentially gel-free polyamic acid compositions | John P. Hummel, Ranee W. Kwong, Robert N. Lang, Leo L. Linehan, Harbans S. Sachdev | 1992-05-19 |