KC

Kangguo Cheng

IBM: 2575 patents #1 of 70,183Top 1%
Globalfoundries: 269 patents #3 of 4,424Top 1%
TE Tessera: 34 patents #14 of 271Top 6%
SS Stmicroelectronics Sa: 19 patents #57 of 1,676Top 4%
AS Adeia Semiconductor Solutions: 13 patents #1 of 57Top 2%
ET Elpis Technologies: 12 patents #1 of 121Top 1%
CEA: 6 patents #716 of 7,956Top 9%
GU Globalfoundries U.S.: 5 patents #206 of 665Top 35%
Samsung: 5 patents #22,466 of 75,807Top 30%
RE Renesas Electronics: 4 patents #1,016 of 4,529Top 25%
IB International Business: 1 patents #4 of 119Top 4%
📍 Schenectady, NY: #1 of 1,353 inventorsTop 1%
🗺 New York: #1 of 115,490 inventorsTop 1%
Overall (All Time): #5 of 4,157,543Top 1%
2819
Patents All Time

Issued Patents All Time

Showing 1,026–1,050 of 2,819 patents

Patent #TitleCo-InventorsDate
10332961 Inner spacer for nanosheet transistors Ruilong Xie, Tenko Yamashita, Chun-Chen Yeh 2019-06-25
10332880 Vertical fin resistor devices Zhenxing Bi, Peng Xu 2019-06-25
10332802 Hybrid-channel nano-sheets FETs Zhenxing Bi, Peng Xu, Wenyu Xu 2019-06-25
10332800 Vertical field effect transistor having U-shaped top spacer Xin Miao, Wenyu Xu, Chen Zhang 2019-06-25
10332799 Vertical silicon/silicon-germanium transistors with multiple threshold voltages Zhenxing Bi, Juntao Li, Peng Xu 2019-06-25
10332796 Fin pitch scaling for high voltage devices and low voltage devices on the same wafer Veeraraghavan S. Basker, Theodorus E. Standaert, Junli Wang 2019-06-25
10332983 Vertical field-effect transistors including uniform gate lengths Choonghyun Lee, Juntao Li, Heng Wu, Peng Xu 2019-06-25
10326022 Self-aligned gate cut with polysilicon liner oxidation Peng Xu 2019-06-18
10326020 Structure and method for forming strained FinFET by cladding stressors Juntao Li 2019-06-18
10326019 Fully-depleted CMOS transistors with U-shaped channel Robert H. Dennard, Bruce B. Doris, Terence B. Hook 2019-06-18
10326017 Formation of a bottom source-drain for vertical field-effect transistors Marc A. Bergendahl, Fee Li Lie, Shogo Mochizuki, Junli Wang 2019-06-18
10325999 Contact area to trench silicide resistance reduction by high-resistance interface removal Veeraraghavan S. Basker, Theodorus E. Standaert, Junli Wang 2019-06-18
10325995 Field effect transistor air-gap spacers with an etch-stop layer Xin Miao, Wenyu Xu, Chen Zhang 2019-06-18
10325817 Semiconductor fin patterning techniques to achieve uniform fin profiles for fin field effect transistors Zhenxing Bi, Juntao Li, Peng Xu 2019-06-18
10319731 Integrated circuit structure having VFET and embedded memory structure and method of forming same Ruilong Xie, Chun-Chen Yeh, Tenko Yamashita 2019-06-11
10319717 Forming on-chip metal-insulator-semiconductor capacitor with pillars Zhenxing Bi, Peng Xu, Chen Zhang 2019-06-11
10319677 Fabrication of vertical fuses from vertical fins James J. Demarest, Juntao Li 2019-06-11
10319645 Method for forming a semiconductor structure containing high mobility semiconductor channel materials Pouya Hashemi, Ali Khakifirooz, Alexander Reznicek 2019-06-11
10319643 Vertical FET with strained channel Choonghyun Lee, Juntao Li, Shogo Mochizuki 2019-06-11
10319640 FinFET devices Veeraraghavan S. Basker, Theodorus E. Standaert, Junli Wang 2019-06-11
10319638 Self-aligned contact cap Peng Xu 2019-06-11
10319813 Nanosheet CMOS transistors Zhenxing Bi, Juntao Li, Peng Xu 2019-06-11
10312370 Forming a sacrificial liner for dual channel devices Huiming Bu, Dechao Guo, Sivananda K. Kanakasabapathy, Peng Xu 2019-06-04
10312350 Nanosheet with changing SiGe percentage for SiGe lateral recess Xin Miao, Wenyu Xu, Chen Zhang 2019-06-04
10312337 Fabrication of nano-sheet transistors with different threshold voltages Karthik Balakrishnan, Pouya Hashemi, Alexander Reznicek 2019-06-04