Issued Patents All Time
Showing 26–45 of 45 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9666528 | BEOL vertical fuse formed over air gap | Marc A. Bergendahl, Christopher J. Penny, Christopher J. Waskiewicz | 2017-05-30 |
| 9553044 | Electrically conductive interconnect including via having increased contact surface area | Hsueh-Chung Chen, Sean Teehan, Chih-Chao Yang | 2017-01-24 |
| 9449871 | Hybrid airgap structure with oxide liner | Marc A. Bergendahl, Christopher J. Penny, Christopher J. Waskiewicz | 2016-09-20 |
| 9406790 | Suspended ring-shaped nanowire structure | Kangguo Cheng, Balasubramanian S. Haran | 2016-08-02 |
| 9331073 | Epitaxially grown quantum well finFETs for enhanced pFET performance | Marc A. Bergendahl, Hong He, Seth L. Knupp, Raghavasimhan Sreenivasan, Sean Teehan +2 more | 2016-05-03 |
| 9318347 | Wafer backside particle mitigation | Marc A. Bergendahl, Alex Richard Hubbard, Richard C. Johnson, Ryan O. Jung, James J. Kelly +3 more | 2016-04-19 |
| 9184042 | Wafer backside particle mitigation | Marc A. Bergendahl, Alex Richard Hubbard, Richard C. Johnson, Ryan O. Jung, James J. Kelly +3 more | 2015-11-10 |
| 9057670 | Transmission electron microscope sample fabrication | Juntao Li | 2015-06-16 |
| 8889564 | Suspended nanowire structure | Kangguo Cheng, Balasubramanian S. Haran | 2014-11-18 |
| 8796128 | Dual metal fill and dual threshold voltage for replacement gate metal devices | Lisa F. Edge, Nathaniel Berliner, Balasubramanian S. Haran, Raymond J. Donohue | 2014-08-05 |
| 8629007 | Method of improving replacement metal gate fill | Balasubramanian S. Haran | 2014-01-14 |
| 8465657 | Post chemical mechanical polishing etch for improved time dependent dielectric breakdown reliability | Kaushik Chanda, Ronald G. Filippi, Roy Iggulden, Edward W. Kiewara, Ping-Chuan Wang +1 more | 2013-06-18 |
| 7835564 | Non-destructive, below-surface defect rendering using image intensity analysis | Delia R. Bearup, Andrew S. Dalton, Loren L. Hahn, Bruce J. Redder, Francis R. Wallingford | 2010-11-16 |
| 7820559 | Structure to improve adhesion between top CVD low-K dielectric and dielectric capping layer | Lawrence A. Clevenger, Stefanie Chiras, Timothy J. Dalton, Darren N. Dunn, Chester T. Dziobkowski +7 more | 2010-10-26 |
| 7651892 | Electrical programmable metal resistor | Chih-Chao Yang, Lawrence A. Clevenger, Louis C. Hsu, Carl Radens | 2010-01-26 |
| 7473636 | Method to improve time dependent dielectric breakdown | Kaushik Chanda, Ronald G. Filippi, Roy Iggulden, Edward W. Kiewra, Vincent J. McGahay +2 more | 2009-01-06 |
| 7402532 | Structure to improve adhesion between top CVD low-k dielectric and dielectric capping layer | Lawrence A. Clevenger, Stefanie Chiras, Timothy J. Dalton, Derren N. Dunn, Chester T. Dziobkowski +7 more | 2008-07-22 |
| 7287325 | Method of forming interconnect structure or interconnect and via structures using post chemical mechanical polishing | Kaushik Chanda, Ronald G. Filippi, Roy Iggulden, Edward W. Kiewra, Ping-Chuan Wang +1 more | 2007-10-30 |
| 7122898 | Electrical programmable metal resistor | Chih-Chao Yang, Lawrence A. Clevenger, Louis C. Hsu, Carl Radens | 2006-10-17 |
| 7102232 | Structure to improve adhesion between top CVD low-k dielectric and dielectric capping layer | Lawrence A. Clevenger, Stefanie Chiras, Timothy J. Dalton, Derren N. Dunn, Chester T. Dziobkowski +7 more | 2006-09-05 |