HH

Herbert L. Ho

IBM: 102 patents #541 of 70,183Top 1%
SA Siemens Aktiengesellschaft: 11 patents #902 of 22,248Top 5%
Globalfoundries: 9 patents #393 of 4,424Top 9%
KT Kabushiki Kaisha Toshiba: 5 patents #5,683 of 21,451Top 30%
GU Globalfoundries U.S.: 4 patents #133 of 665Top 20%
Infineon Technologies Ag: 2 patents #91 of 446Top 25%
📍 New Windsor, NY: #1 of 112 inventorsTop 1%
🗺 New York: #408 of 115,490 inventorsTop 1%
Overall (All Time): #10,532 of 4,157,543Top 1%
117
Patents All Time

Issued Patents All Time

Showing 101–117 of 117 patents

Patent #TitleCo-InventorsDate
6014310 High dielectric TiO.sub.2 -SiN composite films for memory applications Gary B. Bronner, Stephan A. Cohen, David M. Dobuzinsky, Jeffrey P. Gambino, Karen P. Madden 2000-01-11
5923971 Reliable low resistance strap for trench storage DRAM cell using selective epitaxy Andre R. LeBlanc, Jack A. Mandelman, Radhika Srinivasan 1999-07-13
5899724 Method for fabricating a titanium resistor David M. Dobuzinsky, Stephen G. Fugardi, Erwin Hammerl, Samuel C. Ramac, Alvin W. Strong 1999-05-04
5893735 Three-dimensional device layout with sub-groundrule features Reinhard Stengl, Erwin Hammerl, Jack A. Mandelman, Radhika Srinivasan, Alvin P. Short +1 more 1999-04-13
5876788 High dielectric TiO.sub.2 -SiN composite films for memory applications Gary B. Bronner, Stephan A. Cohen, David M. Dobuzinsky, Jeffrey P. Gambino, Karen P. Madden 1999-03-02
5849638 Deep trench with enhanced sidewall surface area David E. Kotecki, Carl Radens 1998-12-15
5844266 Buried strap formation in a DRAM trench capacitor Reinhard Stengl, Erwin Hammerl, Jack A. Mandelman, Radhika Srinivasan, Alvin P. Short 1998-12-01
5827765 Buried-strap formation in a dram trench capacitor Reinhard Stengl, Erwin Hammerl, Jack A. Mandelman, Radhika Srinivasan, Alvin P. Short 1998-10-27
5792685 Three-dimensional device layout having a trench capacitor Erwin Hammerl, Jack A. Mandelman, Bernhard Poschenrieder, Alvin P. Short, Radhika Srinivasan +1 more 1998-08-11
5763315 Shallow trench isolation with oxide-nitride/oxynitride liner John Benedict, David M. Dobuzinsky, Philip L. Flaitz, Erwin Hammerl, James F. Moseman +3 more 1998-06-09
5747866 Application of thin crystalline Si.sub.3 N.sub.4 liners in shallow trench isolation (STI) structures Erwin Hammerl, David M. Dobuzinsky, Herbert Palm, Stephen G. Fugardi, Atul Ajmera +2 more 1998-05-05
5670805 Controlled recrystallization of buried strap in a semiconductor memory device Erwin Hammerl, Jack A. Mandelman, Junichi Shiozawa, Reinhard Stengl 1997-09-23
5656535 Storage node process for deep trench-based DRAM Radhika Srinivasan, Scott D. Halle, Erwin Hammerl, David M. Dobuzinsky, Jack A. Mandelman +1 more 1997-08-12
5643823 Application of thin crystalline Si.sub.3 N.sub.4 liners in shallow trench isolation (STI) structures Erwin Hammerl, David M. Dobuzinsky, J. Herbert Palm, Stephen G. Fugardi, Atul Ajmera +2 more 1997-07-01
5543348 Controlled recrystallization of buried strap in a semiconductor memory device Erwin Hammerl, Jack A. Mandelman, Junichi Shiozawa, Reinhard Stengl 1996-08-06
5447884 Shallow trench isolation with thin nitride liner Paul Fahey, Erwin Hammerl, Mutsuo Morikado 1995-09-05
5356837 Method of making epitaxial cobalt silicide using a thin metal underlayer Peter J. Geiss, Thomas J. Licata, James G. Ryan 1994-10-18