GB

Gary B. Bronner

IBM: 80 patents #845 of 70,183Top 2%
RA Rambus: 25 patents #85 of 549Top 20%
HL Hefei Reliance Memory Limited: 19 patents #3 of 28Top 15%
Infineon Technologies Ag: 5 patents #3,160 of 7,486Top 45%
SA Siemens Aktiengesellschaft: 2 patents #6,658 of 22,248Top 30%
SM Siemens Microelectronics: 1 patents #5 of 40Top 15%
CR Cryptography Research: 1 patents #44 of 64Top 70%
KT Kabushiki Kaisha Toshiba: 1 patents #13,537 of 21,451Top 65%
📍 Los Altos, CA: #40 of 3,651 inventorsTop 2%
🗺 California: #1,366 of 386,348 inventorsTop 1%
Overall (All Time): #8,679 of 4,157,543Top 1%
128
Patents All Time

Issued Patents All Time

Showing 101–125 of 128 patents

Patent #TitleCo-InventorsDate
6087225 Method for dual gate oxide dual workfunction CMOS Badih El-Kareh, Stanley E. Schuster 2000-07-11
6084276 Threshold voltage tailoring of corner of MOSFET device Jeffrey P. Gambino, Jack A. Mandelman, Larry Nesbit 2000-07-04
6063657 Method of forming a buried strap in a DRAM Ramachandra Divakaruni 2000-05-16
6037194 Method for making a DRAM cell with grooved transfer device Toshiharu Furukawa, Mark C. Hakey, Steven J. Holmes, David V. Horak, Jack A. Mandelman +1 more 2000-03-14
6034877 Semiconductor memory array having sublithographic spacing between adjacement trenches and method for making the same Jack A. Mandelman, Donald J. Samuels 2000-03-07
6028004 Process for controlling the height of a stud intersecting an interconnect Jeffrey P. Gambino 2000-02-22
6014310 High dielectric TiO.sub.2 -SiN composite films for memory applications Stephan A. Cohen, David M. Dobuzinsky, Jeffrey P. Gambino, Herbert L. Ho, Karen P. Madden 2000-01-11
5994202 Threshold voltage tailoring of the corner of a MOSFET device Jeffrey P. Gambino, Jack A. Mandelman, Larry Nesbit 1999-11-30
5945707 DRAM cell with grooved transfer device Toshiharu Furukawa, Mark C. Hakey, Steven J. Holmes, David V. Horak, Jack A. Mandelman +1 more 1999-08-31
5937289 Providing dual work function doping Jeffrey P. Gambino, Jack A. Mandelman, Carl Radens, William R. Tonti 1999-08-10
5923991 Methods to prevent divot formation in shallow trench isolation areas Jeffrey P. Gambino, Larry Nesbit 1999-07-13
5908310 Method to form a buried implanted plate for DRAM trench storage capacitors Wilfried Hansch, Wendell P. Noble 1999-06-01
5876788 High dielectric TiO.sub.2 -SiN composite films for memory applications Stephan A. Cohen, David M. Dobuzinsky, Jeffrey P. Gambino, Herbert L. Ho, Karen P. Madden 1999-03-02
5792703 Self-aligned contact wiring process for SI devices Jeffrey P. Gambino 1998-08-11
5766971 Oxide strip that improves planarity David C. Ahlgren, Wesley C. Natzle, Erick G. Walton, Chienfan Yu 1998-06-16
5606188 Fabrication process and structure for a contacted-body silicon-on-insulator dynamic random access memory John K. DeBrosse, Jack A. Mandelman 1997-02-25
5606202 Planarized gate conductor on substrates with above-surface isolation Jack A. Mandelman 1997-02-25
5538592 Non-random sub-lithography vertical stack capacitor Bomy Chen, Son V. Nguyen 1996-07-23
5525531 SOI DRAM with field-shield isolation John K. DeBrosse, Jack A. Mandelman 1996-06-11
5508219 SOI DRAM with field-shield isolation and body contact John K. DeBrosse, Jack A. Mandelman 1996-04-16
5362663 Method of forming double well substrate plate trench DRAM cell array Sang Hoo Dhong, Wei Hwang 1994-11-08
5360758 Self-aligned buried strap for trench type DRAM cells John K. DeBrosse, Donald M. Kenney 1994-11-01
5321647 Semiconductor memory device and operational method with reduced well noise Sang Hoo Dhong 1994-06-14
5300800 Low leakage substrate plate DRAM cell Sang Hoo Dhong, Wei Hwang 1994-04-05
5253202 Word line driver circuit for dynamic random access memories Sang Hoo Dhong, Wei Hwang 1993-10-12