Issued Patents All Time
Showing 101–125 of 190 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10424456 | Fold over emitter and collector field emission transistor | Lawrence A. Clevenger, Michael Rizzolo | 2019-09-24 |
| 10404306 | Paint on micro chip touch screens | Maryam Ashoori, Justin A. Canaperi, Lawrence A. Clevenger, Leigh Anne H. Clevenger, Michael Rizzolo +1 more | 2019-09-03 |
| 10395986 | Fully aligned via employing selective metal deposition | James J. Kelly, Donald F. Canaperi, Michael Rizzolo, Lawrence A. Clevenger | 2019-08-27 |
| 10395977 | Self aligned via and pillar cut for at least a self aligned double pitch | Lawrence A. Clevenger, Michael Rizzolo, Terry A. Spooner, Theodorus E. Standaert | 2019-08-27 |
| 10381561 | Dedicated contacts for controlled electroforming of memory cells in resistive random-access memory array | Takashi Ando, Lawrence A. Clevenger, Chih-Chao Yang | 2019-08-13 |
| 10366920 | Location-specific laser annealing to improve interconnect microstructure | Lawrence A. Clevenger, Bartlet H. DeProspo, Michael Rizzolo | 2019-07-30 |
| 10366952 | Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device | Lawrence A. Clevenger, Bartlet H. DeProspo, Huai Huang, Christopher J. Penny, Michael Rizzolo | 2019-07-30 |
| 10361157 | Method of manufacturing self-aligned interconnects by deposition of a non-conformal air-gap forming layer having an undulated upper surface | Lawrence A. Clevenger, Christopher J. Penny, Michael Rizzolo | 2019-07-23 |
| 10361117 | Selective ILD deposition for fully aligned via with airgap | Christopher J. Penny, Huai Huang, Lawrence A. Clevenger, Michael Rizzolo, Hosadurga Shobha | 2019-07-23 |
| 10347825 | Selective deposition and nitridization of bottom electrode metal for MRAM applications | Joe Lee, Christopher J. Penny, Michael Rizzolo, Chih-Chao Yang | 2019-07-09 |
| 10315451 | Structure, system, method, and recording medium of implementing a directed self-assembled security pattern | Lawrence A. Clevenger, Bartlet H. DeProspo, Michael Rizzolo | 2019-06-11 |
| 10319783 | Integrated magnetic tunnel junction (MTJ) in back end of line (BEOL) interconnects | Michael Rizzolo, Theodorus E. Standaert | 2019-06-11 |
| 10312434 | Selective deposition and nitridization of bottom electrode metal for MRAM applications | Joe Lee, Christopher J. Penny, Michael Rizzolo, Chih-Chao Yang | 2019-06-04 |
| 10297750 | Wraparound top electrode line for crossbar array resistive switching device | Takashi Ando, Lawrence A. Clevenger, Michael Rizzolo, Chih-Chao Yang | 2019-05-21 |
| 10290541 | Barrier layers in trenches and vias | Lawrence A. Clevenger, Cornelius Brown Peethala, Michael Rizzolo, Chih-Chao Yang | 2019-05-14 |
| 10276436 | Selective recessing to form a fully aligned via | Jessica Dechene, Elbert E. Huang, Joe Lee, Theodorus E. Standaert | 2019-04-30 |
| 10276190 | Sentiment analysis of mental health disorder symptoms | Maryam Ashoori, Lawrence A. Clevenger, Leigh Anne H. Clevenger | 2019-04-30 |
| 10276053 | Cognitive system to improve athletic performance with motivation from different training styles | Lawrence A. Clevenger, Leigh Anne H. Clevenger, Jonathan H. Connell, II, Nalini K. Ratha, Michael Rizzolo | 2019-04-30 |
| 10256191 | Hybrid dielectric scheme for varying liner thickness and manganese concentration | Lawrence A. Clevenger, Nicholas Anthony Lanzillo, Takeshi Nogami, Christopher J. Penny, Michael Rizzolo | 2019-04-09 |
| 10242909 | Wet etch removal of Ru selective to other metals | Cornelius Brown Peethala, David L. Rath | 2019-03-26 |
| 10229967 | High-density MIM capacitors | Lawrence A. Clevenger, Bartlet H. DeProspo, Huai Huang, Christopher J. Penny, Michael Rizzolo | 2019-03-12 |
| 10229851 | Self-forming barrier for use in air gap formation | Elbert E. Huang, Takeshi Nogami, Christopher J. Penny | 2019-03-12 |
| 10211155 | Reducing metallic interconnect resistivity through application of mechanical strain | Lawrence A. Clevenger, Nicholas Anthony Lanzillo, Michael Rizzolo, Theodorus E. Standaert | 2019-02-19 |
| 10211153 | Low aspect ratio interconnect | Elbert E. Huang, Raghuveer R. Patlolla, Cornelius Brown Peethala, David L. Rath, Chih-Chao Yang | 2019-02-19 |
| 10211151 | Enhanced self-alignment of vias for asemiconductor device | Lawrence A. Clevenger, Bartlet H. DeProspo, Michael Rizzolo, Nicole Saulnier | 2019-02-19 |