Issued Patents All Time
Showing 51–75 of 198 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8680511 | Bilayer gate dielectric with low equivalent oxide thickness for graphene devices | Christos D. Dimitrakopoulos, Damon B. Farmer, Yu-Ming Lin, Deborah A. Neumayer, Dirk Pfeiffer +1 more | 2014-03-25 |
| 8664109 | Advanced low k cap film formation process for nano electronic devices | Joshua L. Herman, Son V. Nguyen, E. Todd Ryan, Hosadurga Shobha | 2014-03-04 |
| 8658488 | Method for forming semiconductor chip with graphene based devices in an interconnect structure of the chip | Christos D. Dimitrakopoulos, Guy M. Cohen, Stephen M. Gates, Timothy J. McArdle, Chun-Yung Sung | 2014-02-25 |
| 8659093 | Continuous metal semiconductor alloy via for interconnects | Guy M. Cohen, Christos D. Dimitrakopoulos | 2014-02-25 |
| 8658461 | Self aligned carbide source/drain FET | Cyril Cabral, Jr., Josephine B. Chang, Michael A. Guillorn, Christian Lavoie, Eugene J. O'Sullivan | 2014-02-25 |
| 8652950 | C-rich carbon boron nitride dielectric films for use in electronic devices | Son V. Nguyen, Thomas J. Haigh, Jr., Sanjay C. Mehta | 2014-02-18 |
| 8642996 | Graphene nanoribbons and carbon nanotubes fabricated from SiC fins or nanowire templates | Guy M. Cohen, Christos D. Dimitrakopoulos | 2014-02-04 |
| 8637412 | Process to form an adhesion layer and multiphase ultra-low k dielectric material using PECVD | Thomas J. Haigh, Jr., Kelly Malone, Son V. Nguyen, Vishnubhai V. Patel, Hosadurga Shobha | 2014-01-28 |
| 8623761 | Method of forming a graphene cap for copper interconnect structures | Griselda Bonilla, Christos D. Dimitrakopoulos, James B. Hannon, Qinghuang Lin, Deborah A. Neumayer +3 more | 2014-01-07 |
| 8618183 | Materials containing voids with void size controlled on the nanometer scale | Stephen M. Gates, Deborah A. Neumayer, Son V. Nguyen, Vishnubhai V. Patel | 2013-12-31 |
| 8541769 | Formation of a graphene layer on a large substrate | Jack O. Chu, Christos D. Dimitrakopoulos, Marcus O. Freitag, Timothy J. McArdle, Robert L. Wisnieff | 2013-09-24 |
| 8536069 | Multilayered low k cap with conformal gap fill and UV stable compressive stress properties | Mihaela Balseanu, Stephan A. Cohen, Thomas J. Haigh, Jr., Son V. Nguyen, Li-Qun Xia | 2013-09-17 |
| 8530293 | Continuous metal semiconductor alloy via for interconnects | Guy M. Cohen, Christos D. Dimitrakopoulos | 2013-09-10 |
| 8492880 | Multilayered low k cap with conformal gap fill and UV stable compressive stress properties | Mihaela Balseanu, Stephan A. Cohen, Thomas J. Haigh, Jr., Son V. Nguyen, Li-Qun Xia | 2013-07-23 |
| 8481423 | Methods to mitigate plasma damage in organosilicate dielectrics | John C. Arnold, Griselda Bonilla, William J. Cote, Geraud Jean-Michel Dubois, Daniel C. Edelstein +8 more | 2013-07-09 |
| 8476617 | Graphene-containing semiconductor structures and devices on a silicon carbide substrate having a defined miscut angle | Christos D. Dimitrakopoulos, Timothy J. McArdle, John A. Ott, Robert L. Wisnierff | 2013-07-02 |
| 8476743 | C-rich carbon boron nitride dielectric films for use in electronic devices | Son V. Nguyen, Thomas J. Haigh, Jr., Sanjay C. Mehta | 2013-07-02 |
| 8470706 | Methods to mitigate plasma damage in organosilicate dielectrics | John C. Arnold, Griselda Bonilla, William J. Cote, Geraud Jean-Michel Dubois, Daniel C. Edelstein +8 more | 2013-06-25 |
| 8440999 | Semiconductor chip with graphene based devices in an interconnect structure of the chip | Christos D. Dimitrakopoulos, Guy M. Cohen, Stephen M. Gates, Timothy J. McArdle, Chun-Yung Sung | 2013-05-14 |
| 8362596 | Engineered interconnect dielectric caps having compressive stress and interconnect structures containing same | Stephan A. Cohen, Thomas J. Haigh, Jr., Xiao Hu Liu, Son V. Nguyen, Thomas M. Shaw +1 more | 2013-01-29 |
| 8361853 | Graphene nanoribbons, method of fabrication and their use in electronic devices | Guy M. Cohen, Christos D. Dimitrakopoulos, Robert L. Wisnieff | 2013-01-29 |
| 8357608 | Multi component dielectric layer | Stephen M. Gates, Son V. Nguyen, Satyanarayana V. Nitta | 2013-01-22 |
| 8354296 | Semiconductor structure and circuit including ordered arrangement of graphene nanoribbons, and methods of forming same | Christos D. Dimitrakopoulos, Timothy J. McArdle | 2013-01-15 |
| 8299365 | Self-aligned composite M-MOx/dielectric cap for Cu interconnect structures | Son V. Nguyen, Thomas J. Haigh, Jr., Hosadurga Shobha, Tuan A. Vo | 2012-10-30 |
| 8268411 | Materials containing voids with void size controlled on the nanometer scale | Stephen M. Gates, Deborah A. Neumayer, Son V. Nguyen, Vishnubhai V. Patel | 2012-09-18 |