Issued Patents All Time
Showing 76–96 of 96 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6387806 | Filling an interconnect opening with different types of alloys to enhance interconnect reliability | Pin-Chin Connie Wang | 2002-05-14 |
| 6383880 | NH3/N2-plasma treatment for reduced nickel silicide bridging | Minh Van Ngo, Robert A. Huertas | 2002-05-07 |
| 6372673 | Silicon-starved nitride spacer deposition | Paul R. Besser, Minh Van Ngo, George Jonathan Kluth | 2002-04-16 |
| 6362095 | Nickel silicide stripping after nickel silicide formation | George Jonathan Kluth, Jacques Bertrand | 2002-03-26 |
| 6358840 | Forming and filling a recess in interconnect with alloy to minimize electromigration | Pin-Chin Connie Wang | 2002-03-19 |
| 6346479 | Method of manufacturing a semiconductor device having copper interconnects | Pin-Chin Connie Wang | 2002-02-12 |
| 6332989 | Slurry for chemical mechanical polishing of copper | Kai Yang, Steven C. Avanzino | 2001-12-25 |
| 6270635 | Consistent plating system for electroplating | — | 2001-08-07 |
| 6228759 | Method of forming an alloy precipitate to surround interconnect to minimize electromigration | Pin-Chin Connie Wang, Sergey Lopatin | 2001-05-08 |
| 6228768 | Storage-annealing plated CU interconnects | Young-Chang Joo | 2001-05-08 |
| 6143656 | Slurry for chemical mechanical polishing of copper | Kai Yang, Steven C. Avanzino | 2000-11-07 |
| 6121141 | Method of forming a void free copper interconnects | Dirk Brown, Young-Chang Joo, Imran Hashim | 2000-09-19 |
| 6117770 | Method for implanting semiconductor conductive layers | Shekhar Pramanick, Dirk Brown, John A. Iacoponi | 2000-09-12 |
| 6103085 | Electroplating uniformity by diffuser design | John A. Iacoponi, Kai Yang | 2000-08-15 |
| 6103086 | Method of forming reliable copper interconnects with improved hole filling | Axel Preusse, Sergey Lopatin | 2000-08-15 |
| 6096648 | Copper/low dielectric interconnect formation with reduced electromigration | Sergey Lopatin, Takeshi Nogami, Robin Cheung, Guarionex Morales | 2000-08-01 |
| 6017463 | Point of use mixing for LI/plug tungsten polishing slurry to improve existing slurry | Steven C. Avanzino, Steven Douglas Bartlett | 2000-01-25 |
| 5916855 | Chemical-mechanical polishing slurry formulation and method for tungsten and titanium thin films | Steven C. Avanzino, Diana M. Schonauer, Peter A. Burke | 1999-06-29 |
| 5816891 | Performing chemical mechanical polishing of oxides and metals using sequential removal on multiple polish platens to increase equipment throughput | — | 1998-10-06 |
| 5801095 | Production worthy interconnect process for deep sub-half micrometer back-end-of-line technology | Richard J. Huang | 1998-09-01 |
| 5686761 | Production worthy interconnect process for deep sub-half micrometer back-end-of-line technology | Richard J. Huang | 1997-11-11 |