AJ

Ajey Poovannummoottil Jacob

Globalfoundries: 160 patents #4 of 4,424Top 1%
GU Globalfoundries U.S.: 57 patents #7 of 665Top 2%
IBM: 16 patents #6,952 of 70,183Top 10%
SS Stmicroelectronics Sa: 8 patents #170 of 1,676Top 15%
KT Khalifa University Of Science And Technology: 7 patents #5 of 290Top 2%
RE Renesas Electronics: 4 patents #1,016 of 4,529Top 25%
UC University Of Southern California: 4 patents #186 of 1,826Top 15%
University of California: 2 patents #4,561 of 18,278Top 25%
CEA: 2 patents #2,014 of 7,956Top 30%
IN Intel: 2 patents #13,213 of 30,777Top 45%
📍 Los Angeles, CA: #8 of 12,377 inventorsTop 1%
🗺 California: #432 of 386,348 inventorsTop 1%
Overall (All Time): #2,528 of 4,157,543Top 1%
226
Patents All Time

Issued Patents All Time

Showing 151–175 of 226 patents

Patent #TitleCo-InventorsDate
9633947 Folded ballistic conductor interconnect line 2017-04-25
9634123 FinFET device including a dielectrically isolated silicon alloy fin 2017-04-25
9627245 Methods of forming alternative channel materials on a non-planar semiconductor device and the resulting device Bruce B. Doris, Kangguo Cheng, Nicolas Loubet 2017-04-18
9614058 Methods of forming low defect replacement fins for a FinFET semiconductor device and the resulting devices Jody A. Fronheiser, Witold P. Maszara, Kerem Akarvardar 2017-04-04
9589849 Methods of modulating strain in PFET and NFET FinFET semiconductor devices Murat Kerem Akarvardar, Bruce B. Doris, Ali Khakifirooz 2017-03-07
9590040 Methods of forming fins for a FinFET device by forming and replacing sacrificial fin structures with alternative materials Murat Kerem Akarvardar 2017-03-07
9570244 Solid-state supercapacitor Bruce S. Dunn, Chi On Chui, Daniel Membreno, Leland Smith 2017-02-14
9564447 Methods for fabricating programmable devices and related structures Suraj K. Patil, Min-hwa Chi 2017-02-07
9564486 Self-aligned dual-height isolation for bulk FinFET Murat Kerem Akarvardar, Steven Bentley, Kangguo Cheng, Bruce B. Doris, Jody A. Fronheiser +2 more 2017-02-07
9564367 Methods of forming different FinFET devices with different threshold voltages and integrated circuit products containing such devices Witold P. Maszara, Kerem Akarvardar 2017-02-07
9524908 Methods of removing portions of fins by preforming a selectively etchable material in the substrate Yi Qi 2016-12-20
9508853 Channel cladding last process flow for forming a channel region on a FinFET device having a reduced size fin in the channel region Witold P. Maszara, Jody A. Fronheiser 2016-11-29
9496354 Semiconductor devices with dummy gate structures partially on isolation regions Ruilong Xie, Xiuyu Cai, Andreas Knorr, Christopher M. Prindle 2016-11-15
9484428 Non-planar exciton transistor (BiSFET) and methods for making 2016-11-01
9478663 FinFET device including a uniform silicon alloy fin Jody A. Fronheiser, Yi Qi, Sylvie Mignot 2016-10-25
9466664 Uniaxially-strained FD-SOI finFET Pierre Morin, Maud Vinet, Laurent Grenouillet 2016-10-11
9455199 Methods of forming strained and relaxed germanium fins for PMOS and NMOS finFET devices, respectively 2016-09-27
9455140 Methods of forming doped epitaxial SiGe material on semiconductor devices Jody A. Fronheiser, Murat Kerem Akarvardar 2016-09-27
9431306 Methods of forming fin isolation regions on FinFET semiconductor devices using an oxidation-blocking layer of material and by performing a fin-trimming process Bruce B. Doris, Kangguo Cheng, Ali Khakifirooz, Kern Rim 2016-08-30
9425289 Methods of forming alternative channel materials on FinFET semiconductor devices Murat Kerem Akarvardar 2016-08-23
9425315 FinFET semiconductor device with isolated fins made of alternative channel materials Murat Kerem Akarvardar 2016-08-23
9412822 Methods of forming stressed channel regions for a FinFET semiconductor device and the resulting device Xiuyu Cai, Ruilong Xie, Kangguo Cheng, Ali Khakifirooz, Witold P. Maszara 2016-08-09
9406803 FinFET device including a uniform silicon alloy fin Jody A. Fronheiser, Murat Kerem Akarvardar, Steven Bentley 2016-08-02
9385233 Bulk finFET with partial dielectric isolation featuring a punch-through stopping layer under the oxide Murat Kerem Akarvardar 2016-07-05
9373721 Methods of forming a non-planar ultra-thin body semiconductor device and the resulting devices Ruilong Xie, Michael Hargrove 2016-06-21