Issued Patents All Time
Showing 126–150 of 158 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8330094 | Optical sensing module and optical mouse with the same | Kuo-Hsiung Li | 2012-12-11 |
| 8288853 | Three-dimensional package and method of making the same | Min-Lung Huang, Po-Jen Cheng, Kuo-Chung Yee, Ching-Huei Su, Jian-Wen Lo +1 more | 2012-10-16 |
| 8258842 | Dead-time detecting circuit for inductive load and modulation circuit using the same | — | 2012-09-04 |
| 8207785 | Charge pump circuit with improved reliability | — | 2012-06-26 |
| 8174090 | Packaging structure | Zhiqi Wang, Guoqing Yu, Qiuhong Zou, Youjun Wang | 2012-05-08 |
| 8158888 | Circuit substrate and method of fabricating the same and chip package structure | Chi-Chih Shen, Jen-Chuan Chen | 2012-04-17 |
| 8110837 | Sensing module | Hung-Ching Lai, Kuo-Hsiung Li, Hui-Hsuan Chen | 2012-02-07 |
| 8110928 | Stacked-type chip package structure and method of fabricating the same | Chi-Chih Shen, Cheng-Yin Lee | 2012-02-07 |
| 8094449 | Fastening structure of computer peripheral device | — | 2012-01-10 |
| 7946857 | Circuit interface device | — | 2011-05-24 |
| 7945062 | Microelectromechanical microphone packaging system | Sung-Mao Wu, Hsueh-An Yang, Kuo-Pin Yang, Chian-Chi Lin | 2011-05-17 |
| 7811858 | Package and the method for making the same, and a stacked package | Meng-Jen Wang | 2010-10-12 |
| 7795074 | WLCSP target and method for forming the same | Mingda Shao, Guoqing Yu, Hanyu Li, Xiaohua Huang | 2010-09-14 |
| 7781250 | Wafer level chip size package for MEMS devices and method for fabricating the same | Zhiqi Wang, Guoqing Yu, Qinqin Xu | 2010-08-24 |
| 7755155 | Packaging structure and method for fabricating the same | Guoping YU, Zhiqi Wang, Guoqing Yu, Quihong Zou | 2010-07-13 |
| 7741152 | Three-dimensional package and method of making the same | Min-Lung Huang, Po-Jen Cheng, Kuo-Chung Yee, Ching-Huei Su, Jian-Wen Lo +1 more | 2010-06-22 |
| 7706149 | Micro-electro-mechanical-system package and method for manufacturing the same | Hsueh-An Yang, Meng-Jen Wang, Ming-Chiang Lee, Wei-Pin Huang, Feng Cheng | 2010-04-27 |
| 7663213 | Wafer level chip size packaged chip device with a double-layer lead structure and method of fabricating the same | Guoqing Yu, Youjun Wang, Qinqin Xu, Qingwei Wang | 2010-02-16 |
| 7642132 | Three-dimensional package and method of making the same | Min-Lung Huang, Po-Jen Cheng, Kuo-Chung Yee, Ching-Huei Su, Jian-Wen Lo +1 more | 2010-01-05 |
| 7528053 | Three-dimensional package and method of making the same | Min-Lung Huang, Po-Jen Cheng, Kuo-Chung Yee, Ching-Huei Su, Jian-Wen Lo +1 more | 2009-05-05 |
| 7501342 | Device having high aspect-ratio via structure in low-dielectric material and method for manufacturing the same | Po-Jen Cheng, Hsueh-An Yang, Pei-Chun Chen | 2009-03-10 |
| 7491568 | Wafer level package and method for making the same | — | 2009-02-17 |
| 7446404 | Three-dimensional package and method of making the same | Min-Lung Huang, Po-Jen Cheng, Kuo-Chung Yee, Ching-Huei Su, Jian-Wen Lo +1 more | 2008-11-04 |
| 7410886 | Method for fabricating protective caps for protecting elements on a wafer surface | — | 2008-08-12 |
| 7394152 | Wafer level chip size packaged chip device with an N-shape junction inside and method of fabricating the same | Guoqing Yu, Youjun Wang, Qinqin Xu, Qingwei Wang | 2008-07-01 |