Issued Patents All Time
Showing 76–100 of 158 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10126151 | Wafer-level chip package structure and packaging method | Zhiqi Wang, Qiong Yu | 2018-11-13 |
| 10108837 | Fingerprint recognition chip packaging structure and packaging method | Zhiqi Wang, Qiong Yu | 2018-10-23 |
| 10096643 | Fingerprint recognition chip packaging structure and packaging method | Zhiqi Wang, Qiong Yu | 2018-10-09 |
| 10090217 | Chip packaging method and package structure | Zhiqi Wang, Qiong Yu | 2018-10-02 |
| 10075237 | Visible light communication system and method | Hsiang-Chain Hsieh, Chi-Wai Chow, Yen-Ting Chen, Chia-Wei Chen | 2018-09-11 |
| 10067012 | Stress measurement method and system for optical materials | Po-Chi Sung, Zheng Lu, Yu-Liang YEH, Po-Yu Chen | 2018-09-04 |
| 10036677 | Method for analyzing stress in an object | Po-Chi Sung, Yu-An Chiang, Te Heng Hung | 2018-07-31 |
| 10013388 | Dynamic peer-to-peer configuration | — | 2018-07-03 |
| 10006761 | Method and system for on-line real-time measuring the surface topography and out-of plane deformation by using phase-shifting shadow moiré method | Wen-Yi Kang, Ya-Hsin Chang, Hsuan-Hao Hsu | 2018-06-26 |
| 9952034 | Optical interferometric system for measurement of a full-field thickness of a plate-like object in real time | Po-Chi Sung | 2018-04-24 |
| 9883115 | Method of determining whole-scene image by using multiple image-capturing devices | Chi-Hung Huang, Yung-Hsiang Chen | 2018-01-30 |
| D806669 | Handset | Heikki Kangasmaa, Tomi Suoniemi, Mikko Vesa, Mikko Pesonen | 2018-01-02 |
| 9761744 | System and method for manufacturing photovoltaic structures with a metal seed layer | — | 2017-09-12 |
| 9762897 | Conic section calibration object for calibrating image capturing device | Chi-Hung Huang, Yung-Hsiang Chen | 2017-09-12 |
| 9748162 | Chip to wafer package with top electrodes and method of forming | Zhiqi Wang, Junjie Li, Ying Yang, Qiong Yu | 2017-08-29 |
| 9644947 | Optical interferometric apparatus for real-time full-field thickness inspection and method thereof | Chi-Hung Huang, Po-Chi Sung, Meng-Hsiu Li | 2017-05-09 |
| 9601531 | Wafer-level packaging structure for image sensors with packaging cover dike structures corresponding to scribe line regions | Zhiqi Wang, Qiong Yu | 2017-03-21 |
| 9584184 | Unified front-end receiver interface for accommodating incoming signals via AC-coupling or DC-coupling | Miao Li, Xiaohua Kong, Jingcheng Zhuang | 2017-02-28 |
| 9568302 | Concentric circle adjusting apparatus for multiple image capturing device | Chi-Hung Huang, Yung-Hsiang Chen | 2017-02-14 |
| D773426 | Handset | Yong Kyou Lee | 2016-12-06 |
| 9455298 | Wafer-level packaging method of BSI image sensors having different cutting processes | Zhi Wang, Qiong Yu | 2016-09-27 |
| 9430478 | Anchor image identification for vertical video search | Xiao Kong, Rui Cai, Haifeng Li, Yanfeng Sun | 2016-08-30 |
| 9395173 | Multi-functioned optical measurement device and method for optically measuring a plurality of parameters | Ming-Hsing Shen, Chi-Hung Huang, Jyh-Rou SZE, Chun-Li Chang | 2016-07-19 |
| 9398286 | Multi-image capture device capturing images by means of circular motion | Chi-Hung Huang, Yung-Hsiang Chen, Tai-Shan Liao, Hsiao-Yu Chou | 2016-07-19 |
| 9362765 | Systems and methods for a power adapter for mobile devices | Piotr Pawel Blaszczak, Nicholas Robert Matteson | 2016-06-07 |