Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9455298 | Wafer-level packaging method of BSI image sensors having different cutting processes | Qiong Yu, Wei-Chung Wang | 2016-09-27 |
| 9305961 | Wafer-level packaging method of BSI image sensors having different cutting processes | Qiong Yu, Wei-Chung Wang | 2016-04-05 |