Issued Patents All Time
Showing 26–50 of 97 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9054256 | Tunneling-junction solar cell with copper grid for concentrated photovoltaic application | Zheng Xu, Jiunn Benjamin Heng, Chentao Yu | 2015-06-09 |
| 9012766 | Aluminum grid as backside conductor on epitaxial silicon thin film solar cells | Chentao Yu, Zheng Xu, Jiunn Benjamin Heng | 2015-04-21 |
| 8872020 | Heterojunction solar cell based on epitaxial crystalline-silicon thin film on metallurgical silicon substrate design | Chentao Yu, Jiunn Benjamin Heng, Zheng Xu, Jianjun Liang | 2014-10-28 |
| 8696875 | Self-ionized and inductively-coupled plasma for sputtering and resputtering | Peijun Ding, Rong Tao, Zheng Xu, Daniel C. Lubben, Suraj Rengarajan +7 more | 2014-04-15 |
| 8686283 | Solar cell with oxide tunneling junctions | Jiunn Benjamin Heng, Chentao Yu, Zheng Xu | 2014-04-01 |
| 8668816 | Self-ionized and inductively-coupled plasma for sputtering and resputtering | Peijun Ding, Rong Tao, Zheng Xu, Daniel C. Lubben, Suraj Rengarajan +7 more | 2014-03-11 |
| 8637761 | Solar cells fabricated by using CVD epitaxial Si films on metallurgical-grade Si wafers | Zheng Xu, Peijun Ding, Chentao Yu, Guanghua Song, Jianjun Liang | 2014-01-28 |
| 8283557 | Heterojunction solar cell based on epitaxial crystalline-silicon thin film on metallurgical silicon substrate design | Chentao Yu, Jiunn Benjamin Heng, Zheng Xu, Jianjun Liang | 2012-10-09 |
| 8283559 | Silicon-based dielectric stack passivation of Si-epitaxial thin-film solar cells | Chentao Yu, Jiunn Benjamin Heng | 2012-10-09 |
| 7687909 | Metal / metal nitride barrier layer for semiconductor device applications | Peijun Ding, Zheng Xu, Hong Mei Zhang, Xianmin Tang, Praburam Gopalraja +7 more | 2010-03-30 |
| 7547644 | Methods and apparatus for forming barrier layers in high aspect ratio vias | Fusen Chen, Ling Chen, Walter Glenn, Praburam Gopalraja | 2009-06-16 |
| 7504006 | Self-ionized and capacitively-coupled plasma for sputtering and resputtering | Praburam Gopalraja, Xianmin Tang, John C. Forster, Umesh M. Kelkar | 2009-03-17 |
| 7335282 | Sputtering using an unbalanced magnetron | Praburam Gopalraja, Fusen Chen, John C. Forster | 2008-02-26 |
| 7294245 | Cover ring and shield supporting a wafer ring in a plasma reactor | — | 2007-11-13 |
| 7294574 | Sputter deposition and etching of metallization seed layer for overhang and sidewall improvement | Peijun Ding, Fuhong Zhang, Hsien-Lung Yang, Michael Miller, Jick Yu +2 more | 2007-11-13 |
| 7253109 | Method of depositing a tantalum nitride/tantalum diffusion barrier layer system | Peijun Ding, Zheng Xu, Hong Mei Zhang, Xianmin Tang, Praburam Gopalraja +7 more | 2007-08-07 |
| 6991709 | Multi-step magnetron sputtering process | Praburam Gopalraja, Fusen Chen, Girish Dixit, Zheng Xu, Wei Wang +1 more | 2006-01-31 |
| 6974771 | Methods and apparatus for forming barrier layers in high aspect ratio vias | Fusen Chen, Ling Chen, Walter Glenn, Praburam Gopalraja | 2005-12-13 |
| 6960284 | Rotational and reciprocal radial movement of a sputtering magnetron | Peijun Ding, Zheng Xu | 2005-11-01 |
| 6911124 | Method of depositing a TaN seed layer | Xianmin Tang, Praburam Gopalraja, Suraj Rengarajan, John C. Forster, Peijun Ding | 2005-06-28 |
| 6899796 | Partially filling copper seed layer | Wei Wang, Anantha K. Subramani, Praburam Gopalraja, Jick Yu, Fusen Chen | 2005-05-31 |
| 6893541 | Multi-step process for depositing copper seed layer in a via | Tony P. Chiang, Yu D. Cong, Peijun Ding, Howard H. Tang, Anish Tolia | 2005-05-17 |
| 6884329 | Diffusion enhanced ion plating for copper fill | Wei Wang, Anantha K. Subramani, Praburam Gopalraja, Jick Yu, Fusen Chen | 2005-04-26 |
| 6790323 | Self ionized sputtering using a high density plasma source | Praburam Gopalraja, Fusen Chen, John E. Foster | 2004-09-14 |
| 6790326 | Magnetron for a vault shaped sputtering target having two opposed sidewall magnets | Anantha K. Subramani, Umesh M. Kelkar, Praburam Gopalraja | 2004-09-14 |