Issued Patents All Time
Showing 76–97 of 97 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6271592 | Sputter deposited barrier layers | Edwin Kim, Michael Nam, Chris Cha, Gongda Yao, Sophia Lee +2 more | 2001-08-07 |
| 6251242 | Magnetron and target producing an extended plasma region in a sputter reactor | Praburam Gopalraja | 2001-06-26 |
| 6238528 | Plasma density modulator for improved plasma density uniformity and thickness uniformity in an ionized metal plasma source | Zheng Xu, Fusen Chen | 2001-05-29 |
| 6238803 | Titanium nitride barrier layers | Zheng Xu, Fusen Chen | 2001-05-29 |
| 6228236 | Sputter magnetron having two rotation diameters | Michael Rosenstein, Leif DeLaurentis, James Van Gogh, Alan Liu | 2001-05-08 |
| 6221221 | Apparatus for providing RF return current path control in a semiconductor wafer processing system | Ayad A. Al-Shaikh, Michael Rosenstein, Bradley O. Stimson, Praburam Gopalraja | 2001-04-24 |
| 6183614 | Rotating sputter magnetron assembly | — | 2001-02-06 |
| 6176981 | Wafer bias ring controlling the plasma potential in a sustained self-sputtering reactor | Liubo Hong, John C. Forster | 2001-01-23 |
| 6059945 | Sputter target for eliminating redeposition on the target sidewall | James Van Gogh | 2000-05-09 |
| 6042706 | Ionized PVD source to produce uniform low-particle deposition | — | 2000-03-28 |
| 6007684 | Process for forming improved titanium-containing barrier layers | Fusen Chen | 1999-12-28 |
| 5985759 | Oxygen enhancement of ion metal plasma (IMP) sputter deposited barrier layers | Edwin Kim, Michael Nam, Chris Cha, Gongda Yao, Sophia Lee +2 more | 1999-11-16 |
| 5976334 | Reliable sustained self-sputtering | Zheng Xu | 1999-11-02 |
| 5914018 | Sputter target for eliminating redeposition on the target sidewall | James Van Gogh | 1999-06-22 |
| 5897752 | Wafer bias ring in a sustained self-sputtering reactor | Liubo Hong, John C. Forster | 1999-04-27 |
| 5895266 | Titanium nitride barrier layers | Zheng Xu, Fusen Chen | 1999-04-20 |
| 5876576 | Apparatus for sputtering magnetic target materials | — | 1999-03-02 |
| 5858184 | Process for forming improved titanium-containing barrier layers | Fusen Chen | 1999-01-12 |
| 5851364 | Method for forming aluminum contacts | Zheng Xu | 1998-12-22 |
| 5841624 | Cover layer for a substrate support chuck and method of fabricating same | Zheng Xu, Fusen Chen | 1998-11-24 |
| 5736021 | Electrically floating shield in a plasma reactor | Peijun Ding, Zheng Xu | 1998-04-07 |
| 5685960 | Method for forming aluminum contacts | Zheng Xu | 1997-11-11 |