Issued Patents All Time
Showing 51–75 of 97 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6787006 | Operating a magnetron sputter reactor in two modes | Praburam Gopalraja, Fusen Chen, Girish Dixit, Zheng Xu, Wei Wang +1 more | 2004-09-07 |
| 6784096 | Methods and apparatus for forming barrier layers in high aspect ratio vias | Fusen Chen, Ling Chen, Walter Glenn, Praburam Gopalraja | 2004-08-31 |
| 6758949 | Magnetically confined metal plasma sputter source with magnetic control of ion and neutral densities | Wei Wang, Praburam Gopalraja | 2004-07-06 |
| 6743340 | Sputtering of aligned magnetic materials and magnetic dipole ring used therefor | — | 2004-06-01 |
| 6730196 | Auxiliary electromagnets in a magnetron sputter reactor | Wei Wang, Praburam Gopalraja | 2004-05-04 |
| 6709553 | Multiple-step sputter deposition | Wei Wang, Praburam Gopalraja | 2004-03-23 |
| 6692617 | Sustained self-sputtering reactor having an increased density plasma | Peijun Ding, Zheng Xu | 2004-02-17 |
| 6627050 | Method and apparatus for depositing a tantalum-containing layer on a substrate | Michael Miller, Peijun Ding, Howard H. Tang, Tony P. Chiang | 2003-09-30 |
| 6582569 | Process for sputtering copper in a self ionized plasma | Tony P. Chiang, Yu D. Cong, Peijun Ding, Howard H. Tang, Anish Tolia | 2003-06-24 |
| 6579421 | Transverse magnetic field for ionized sputter deposition | — | 2003-06-17 |
| 6497802 | Self ionized plasma sputtering | — | 2002-12-24 |
| 6485618 | Integrated copper fill process | Praburam Gopalraja, Fusen Chen, Girish Dixit, Zheng Xu, Sankaram Athreya +2 more | 2002-11-26 |
| 6485617 | Sputtering method utilizing an extended plasma region | Praburam Gopalraja | 2002-11-26 |
| 6451177 | Vault shaped target and magnetron operable in two sputtering modes | Praburam Gopalraja, Fusen Chen, Girish Dixit, Zheng Xu, Wei Wang +1 more | 2002-09-17 |
| 6444104 | Sputtering target having an annular vault | Praburam Gopalraja | 2002-09-03 |
| 6436251 | Vault-shaped target and magnetron having both distributed and localized magnets | Praburam Gopalraja, Wei Wang | 2002-08-20 |
| 6413382 | Pulsed sputtering with a small rotating magnetron | Wei Wang, Praburam Gopalraja, Zheng Xu | 2002-07-02 |
| 6413383 | Method for igniting a plasma in a sputter reactor | Tony P. Chiang, Yu D. Cong, Peijun Ding, Howard H. Tang, Anish Tolia | 2002-07-02 |
| 6406599 | Magnetron with a rotating center magnet for a vault shaped sputtering target | Anantha K. Subramani, Umesh M. Kelkar, Praburam Gopalraja | 2002-06-18 |
| 6398929 | Plasma reactor and shields generating self-ionized plasma for sputtering | Tony P. Chiang, Yu D. Cong, Peijun Ding, Howard H. Tang, Anish Tolia | 2002-06-04 |
| 6358376 | Biased shield in a magnetron sputter reactor | Wei Wang, Praburam Gopalraja | 2002-03-19 |
| 6306265 | High-density plasma for ionized metal deposition capable of exciting a plasma wave | Praburam Gopalraja, Fusen Chen, John C. Forster | 2001-10-23 |
| 6290825 | High-density plasma source for ionized metal deposition | — | 2001-09-18 |
| 6277249 | Integrated process for copper via filling using a magnetron and target producing highly energetic ions | Praburam Gopalraja, Fusen Chen, Girish Dixit, Zheng Xu, Sankaram Athreya +2 more | 2001-08-21 |
| 6274008 | Integrated process for copper via filling | Praburam Gopalraja, Fusen Chen, Girish Dixit, Zheng Xu, Sankaram Athreya +2 more | 2001-08-14 |