Issued Patents All Time
Showing 26–38 of 38 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7247080 | Feedback controlled polishing processes | Boguslaw A. Swedek, Arulkumar Shanmugasundram | 2007-07-24 |
| 7074109 | Chemical mechanical polishing control system and method | Jeffrey Drue David, Manoocher Birang, Jimin Zhang, Boguslaw A. Swedek | 2006-07-11 |
| 7024268 | Feedback controlled polishing processes | Boguslaw A. Swedek, Arulkumar Shanmugasundram | 2006-04-04 |
| 6991516 | Chemical mechanical polishing with multi-stage monitoring of metal clearing | Jeffrey Drue David, Dirk De Roover, Jimin Zhang, Boguslaw A. Swedek, Manoocher Birang | 2006-01-31 |
| 6945845 | Chemical mechanical polishing apparatus with non-conductive elements | Sandeep Rammohan Koppikar, Jeffrey Drue David, Boguslaw A. Swedek, Nils Johansson | 2005-09-20 |
| 6645061 | Polishing pad having a grooved pattern for use in chemical mechanical polishing | Thomas H. Osterheld, Fred C. Redeker, Ginetto Addiego | 2003-11-11 |
| 6572453 | Multi-fluid polishing process | Kapila Wijekoon, Stan Tsai, Yuchun Wang, Fred C. Redeker, Madhavi R. Chandrachood +1 more | 2003-06-03 |
| 6371836 | Groove cleaning device for chemical-mechanical polishing | Brian J. Brown, Robert D. Tolles, James Nystrom, Madhavi R. Chandrachood | 2002-04-16 |
| 6273806 | Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus | Fred C. Redeker, Thomas H. Osterheld, Ginnetto Addiego | 2001-08-14 |
| 6251001 | Substrate polishing with reduced contamination | Jay D. Pinson, II, Brian J. Brown, Thomas H. Osterheld, Benjamin A. Bonner, Nitin Shah +1 more | 2001-06-26 |
| 6220941 | Method of post CMP defect stability improvement | Boris Fishkin, Charles C. Garretson, Peter McKeever, Thomas H. Osterheld, Gopalakrishna B. Prabhu +2 more | 2001-04-24 |
| 6135868 | Groove cleaning device for chemical-mechanical polishing | Brian J. Brown, Robert D. Tolles, James Nystrom, Madhavi R. Chandrachood | 2000-10-24 |
| 5984769 | Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus | Thomas H. Osterheld, Fred C. Redeker, Ginetto Addiego | 1999-11-16 |