YL

Ying Li

AM AMD: 2 patents #3,994 of 9,279Top 45%
Globalfoundries: 1 patents #2,221 of 4,424Top 55%
📍 Beijing, NY: #10 of 175 inventorsTop 6%
Overall (All Time): #10,695 of 4,157,543Top 1%
116
Patents All Time

Issued Patents All Time

Showing 101–116 of 116 patents

Patent #TitleCo-InventorsDate
7585704 Method of producing highly strained PECVD silicon nitride thin films at low temperature Michael P. Belyansky, Oleg Gluschenkov, Anupama Mallikarjunan 2009-09-08
7487247 Systems, methods and computer program products for improving placement performance of message transforms by exploiting aggressive replication Robert Evan Strom 2009-02-03
7482282 Use of dilute hydrochloric acid in advanced interconnect contact clean in nickel semiconductor technologies David F. Hilscher 2009-01-27
7446062 Device having dual etch stop liner and reformed silicide layer and related methods Dureseti Chidambarrao, Rajeev Malik, Shreesh Narasimha 2008-11-04
7446395 Device having dual etch stop liner and protective layer Dureseti Chidambarrao, Rajeev Malik, Shreesh Narasimha 2008-11-04
7411227 CMOS silicide metal gate integration Ricky S. Amos, Diane C. Boyd, Cyril Cabral, Jr., Richard D. Kaplan, Jakub Kedzierski +6 more 2008-08-12
7382933 System and method for semantic video segmentation based on joint audiovisual and text analysis Chitra Dorai, Youngja Park 2008-06-03
7380005 Systems, methods and computer program products for improving placement performance of message transforms by exploiting aggressive replication Robert Evan Strom 2008-05-27
7348635 Device having enhanced stress state and related methods Dureseti Chidambarrao, Rajeev Malik, Shreesh Narasimha, Haining Yang, Huilong Zhu 2008-03-25
7344983 Clustered surface preparation for silicide and metal contacts Sadanand V. Deshpande, Kevin E. Mello, Renee T. Mo, Wesley C. Natzle, Kirk D. Peterson +1 more 2008-03-18
7306983 Method for forming dual etch stop liner and protective layer in a semiconductor device Dureseti Chidambarrao, Rajeev Malik, Shreesh Narasimha 2007-12-11
7244644 Undercut and residual spacer prevention for dual stressed layers Huilong Zhu, Brian L. Tessier, Huicai Zhong 2007-07-17
7056782 CMOS silicide metal gate integration Ricky S. Amos, Diane C. Boyd, Cyril Cabral, Jr., Richard D. Kaplan, Jakub Kedzierski +6 more 2006-06-06
6989318 Method for reducing shallow trench isolation consumption in semiconductor devices Bruce B. Doris 2006-01-24
6921711 Method for forming metal replacement gate of high performance Cyril Cabral, Jr., Paul C. Jamison, Victor Ku, Vijay Narayanan, An Steegen +2 more 2005-07-26
5520769 Method for measuring concentration of dopant within a semiconductor substrate Michael Barrett, Chih-Kang Shih, Donald A. Tiffin, Michael J. Dennis 1996-05-28