QX

Qi Xiang

AM AMD: 175 patents #10 of 9,279Top 1%
IN Intel: 18 patents #2,286 of 30,777Top 8%
Globalfoundries: 9 patents #393 of 4,424Top 9%
CM Chartered Semiconductor Manufacturing: 1 patents #419 of 840Top 50%
LS Lattice Semiconductor: 1 patents #317 of 544Top 60%
VA Vantis: 1 patents #13 of 24Top 55%
📍 San Jose, CA: #53 of 32,062 inventorsTop 1%
🗺 California: #527 of 386,348 inventorsTop 1%
Overall (All Time): #3,187 of 4,157,543Top 1%
205
Patents All Time

Issued Patents All Time

Showing 126–150 of 205 patents

Patent #TitleCo-InventorsDate
6562717 Semiconductor device having multiple thickness nickel silicide layers Christy Mei-Chu Woo, George Jonathan Kluth 2003-05-13
6562718 Process for forming fully silicided gates Ercan Adem, Jacques Bertrand, Paul R. Besser, Matthew S. Buynoski, John Foster +5 more 2003-05-13
6555879 SOI device with metal source/drain and method of fabrication Zoran Krivokapic, Bin Yu 2003-04-29
6555453 Fully nickel silicided metal gate with shallow junction formed Christy Mei-Chu Woo, George Jonathan Kluth 2003-04-29
6555439 Partial recrystallization of source/drain region before laser thermal annealing Robert B. Ogle, Eric N. Paton, Cyrus E. Tabery, Bin Yu 2003-04-29
6551888 Tuning absorption levels during laser thermal annealing Cyrus E. Tabery, Eric N. Paton, Bin Yu, Robert B. Ogle 2003-04-22
6544872 Dopant implantation processing for improved source/drain interface with metal silicides Matthew S. Buynoski, George Jonathan Kluth 2003-04-08
6534822 Silicon on insulator field effect transistor with a double Schottky gate structure Matthew S. Buynoski 2003-03-18
6528858 MOSFETs with differing gate dielectrics and method of formation Bin Yu, Olov Karlsson, Haihong Wang, Zoran Krivokapic 2003-03-04
6528362 Metal gate with CVD amorphous silicon layer for CMOS devices and method of making with a replacement gate process Paul R. Besser, Matthew S. Buynoski 2003-03-04
6525381 Semiconductor-on-insulator body-source contact using shallow-doped source, and method Wei Long, Yowjuang W. Liu 2003-02-25
6524929 Method for shallow trench isolation using passivation material for trench bottom liner Philip A. Fisher 2003-02-25
6518154 Method of forming semiconductor devices with differently composed metal-based gate electrodes Matthew S. Buynoski, Paul R. Besser 2003-02-11
6518107 Non-arsenic N-type dopant implantation for improved source/drain interfaces with nickel silicides Matthew S. Buynoski, Paul R. Besser 2003-02-11
6514809 SOI field effect transistors with body contacts formed by selective etch and fill 2003-02-04
6504214 MOSFET device having high-K dielectric layer Bin Yu 2003-01-07
6492249 High-K gate dielectric process with process with self aligned damascene contact to damascene gate and a low-k inter level dielectric Matthew S. Buynoski, Ming-Ren Lin 2002-12-10
6486038 Method for and device having STI using partial etch trench bottom liner Witold P. Maszara, Ming-Ren Lin 2002-11-26
6479866 SOI device with self-aligned selective damage implant, and method 2002-11-12
6475874 Damascene NiSi metal gate high-k transistor Paul R. Besser, Matthew S. Buynoski, John Foster, Paul L. King, Eric N. Paton 2002-11-05
6465334 Enhanced electroless deposition of dielectric precursor materials for use in in-laid gate MOS transistors Matthew S. Buynoski, Paul R. Besser, Paul L. King, Eric N. Paton 2002-10-15
6465309 Silicide gate transistors Paul R. Besser, Matthew S. Buynoski, John Foster, Paul L. King, Eric N. Paton 2002-10-15
6465267 Method of measuring gate capacitance to determine the electrical thickness of gate dielectrics Haihong Wang 2002-10-15
6458679 Method of making silicide stop layer in a damascene semiconductor structure Eric N. Paton, Paul R. Besser, Matthew S. Buynoski, Paul L. King, John Foster 2002-10-01
6451693 Double silicide formation in polysicon gate without silicide in source/drain extensions Christy Mei-Chu Woo, George Jonathan Kluth 2002-09-17