Issued Patents 2023
Showing 26–43 of 43 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11705420 | Multi-bump connection to interconnect structure and manufacturing method thereof | Tsung-Yen Lee, Chia-Kuei Hsu, Shang-Lun Tsai, Ming-Chih Yew | 2023-07-18 |
| 11705406 | Package structure and method for forming the same | Po-Chen Lai, Chin-Hua Wang, Ming-Chih Yew, Li-Ling Liao, Tsung-Yen Lee +1 more | 2023-07-18 |
| 11699631 | Semiconductor device and manufacturing method thereof | Shu-Shen Yeh, Hui Yu, Shyue-Ter Leu, Shin-Puu Jeng | 2023-07-11 |
| 11699668 | Semiconductor device package having warpage control and method of forming the same | Shu-Shen Yeh, Che-Chia Yang, Chia-Kuei Hsu, Ming-Chih Yew, Shin-Puu Jeng | 2023-07-11 |
| 11694941 | Semiconductor die package with multi-lid structures and method for forming the same | Shu-Shen Yeh, Che-Chia Yang, Chia-Kuei Hsu, Ming-Chih Yew, Shin-Puu Jeng | 2023-07-04 |
| 11694974 | Semiconductor die with warpage release layer structure in package and fabricating method thereof | Chin-Hua Wang, Kuang-Chun Lee, Shu-Shen Yeh, Tsung-Yen Lee, Shin-Puu Jeng | 2023-07-04 |
| 11682602 | Semiconductor device and method of manufacture | Shu-Shen Yeh, Chin-Hua Wang, Chia-Kuei Hsu, Shin-Puu Jeng | 2023-06-20 |
| 11676916 | Structure and formation method of package with warpage-control element | Yu-Sheng Lin, Chien-Hung Chen, Po-Chen Lai, Shin-Puu Jeng | 2023-06-13 |
| 11676826 | Semiconductor die package with ring structure for controlling warpage of a package substrate | Yu-Sheng Lin, Shu-Shen Yeh, Chin-Hua Wang, Shin-Puu Jeng | 2023-06-13 |
| 11670601 | Stacking via structures for stress reduction | Shu-Shen Yeh, Che-Chia Yang, Chin-Hua Wang, Shin-Puu Jeng, Chia-Hsiang Lin | 2023-06-06 |
| 11652037 | Semiconductor package and method of manufacture | Chia-Kuei Hsu, Ming-Chih Yew, Po-Chen Lai, Shu-Shen Yeh, Shin-Puu Jeng | 2023-05-16 |
| 11637087 | Multi-chip device and method of formation | Chin-Hua Wang, Po-Chen Lai, Shu-Shen Yeh, Tsung-Yen Lee, Shin-Puu Jeng | 2023-04-25 |
| 11610835 | Organic interposer including intra-die structural reinforcement structures and methods of forming the same | Li-Ling Liao, Ming-Chih Yew, Chia-Kuei Hsu, Shu-Shen Yeh, Shin-Puu Jeng | 2023-03-21 |
| 11605600 | Package structure with reinforced element and formation method thereof | Shin-Puu Jeng, Shuo-Mao Chen, Chia-Hsiang Lin | 2023-03-14 |
| 11600575 | Method for forming chip package structure | Shin-Puu Jeng, Techi Wong, Ming-Chih Yew, Po-Hao Tsai, Po-Yao Chuang | 2023-03-07 |
| 11594477 | Semiconductor package and method of manufacturing semiconductor package | Chia-Kuei Hsu, Ming-Chih Yew, Shu-Shen Yeh, Shin-Puu Jeng | 2023-02-28 |
| 11574861 | Semiconductor package | Chin-Hua Wang, Shu-Shen Yeh, Yu-Sheng Lin, Shin-Puu Jeng | 2023-02-07 |
| 11557559 | Package structure | Tsung-Yen Lee, Chin-Hua Wang, Ming-Chih Yew, Shin-Puu Jeng | 2023-01-17 |