Issued Patents 2023
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855191 | Vertical FET with contact to gate above active fin | Brent A. Anderson, Indira Seshadri, Chen Zhang, Ruilong Xie, Joshua M. Rubin +1 more | 2023-12-26 |
| 11852582 | Automatic photocurrent spectrum measurement system based on fourier infrared spectrometer | Liangqing Zhu, Liyan Shang, Le Wang, Zhigao Hu | 2023-12-26 |
| 11830774 | Buried contact through fin-to-fin space for vertical transport field effect transistor | Brent A. Anderson | 2023-11-28 |
| 11817501 | Three-dimensional, monolithically stacked field effect transistors formed on the front and backside of a wafer | Sung-Dae Suk, Somnath Ghosh, Chen Zhang, Devendra K. Sadana, Dechao Guo | 2023-11-14 |
| 11817497 | Vertical field effect transistor inverter with single fin device | Ruilong Xie, Alexander Reznicek, Chen Zhang | 2023-11-14 |
| 11777034 | Hybrid complementary field effect transistor device | Ruilong Xie, Chen Zhang, Jingyun Zhang, Pietro Montanini | 2023-10-03 |
| 11764298 | VTFET with buried power rails | Chen Zhang, Ruilong Xie, Heng Wu, Brent A. Anderson | 2023-09-19 |
| 11749744 | Fin structure for vertical transport field effect transistor | Heng Wu, Lan Yu, Dechao Guo, Ruqiang Bao, Ruilong Xie | 2023-09-05 |
| 11715794 | VTFET with cell height constraints | Heng Wu, Ruilong Xie, Lan Yu, Alexander Reznicek | 2023-08-01 |
| 11710666 | Dummy fin template to form a self-aligned metal contact for output of vertical transport field effect transistor | Brent A. Anderson, Albert M. Young | 2023-07-25 |
| 11710521 | Static random-access memory cell design | Lan Yu, Heng Wu, Ruqiang Bao, Dechao Guo | 2023-07-25 |
| 11695038 | Forming single and double diffusion breaks for fin field-effect transistor structures | Juntao Li, Kangguo Cheng, Ruilong Xie | 2023-07-04 |
| 11688635 | Oxygen-free replacement liner for improved transistor performance | Heng Wu, Dechao Guo, Ruqiang Bao | 2023-06-27 |
| 11670580 | Subtractive via etch for MIMCAP | Yann Mignot, Hsueh-Chung Chen, Mary Claire Silvestre, Chi-Chun Liu | 2023-06-06 |
| 11665877 | Stacked FET SRAM design | Chen Zhang, Ruilong Xie, Dechao Guo | 2023-05-30 |
| 11664455 | Wrap-around bottom contact for bottom source/drain | Alexander Reznicek, Ruilong Xie, Bruce B. Doris | 2023-05-30 |
| 11658116 | Interconnects on multiple sides of a semiconductor structure | Albert M. Chu, Dechao Guo, Brent A. Anderson | 2023-05-23 |
| 11621189 | Barrier-less prefilled via formation | Nicholas Anthony Lanzillo, Hosadurga Shobha, Lawrence A. Clevenger, Christopher J. Penny, Robert R. Robison +1 more | 2023-04-04 |
| 11621332 | Wraparound contact to a buried power rail | Ruilong Xie, Veeraraghavan S. Basker, Alexander Reznicek | 2023-04-04 |
| 11615988 | FinFET devices | Veeraraghavan S. Basker, Kangguo Cheng, Theodorus E. Standaert | 2023-03-28 |