Issued Patents 2022
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11495552 | Substrate integrated thin film capacitors using amorphous high-k dielectrics | Aleksandar Aleksov, Thomas L. Sounart, Kristof Darmawikarta, Prithwish Chatterjee, Andrew J. Brown | 2022-11-08 |
| 11460499 | Dual sided thermal management solutions for integrated circuit packages | Aleksandar Aleksov, Veronica Strong, Brandon M. Rawlings, Johanna M. Swan, Shawna M. Liff | 2022-10-04 |
| 11393777 | Microelectronic assemblies | Adel A. Elsherbini, Patrick Morrow, Kimin Jun, Brennen Mueller, Shawna M. Liff +2 more | 2022-07-19 |
| 11387187 | Embedded very high density (VHD) layer | Andrew Collins, Jianyong Xie, Sujit Sharan, Aleksandar Aleksov | 2022-07-12 |
| 11387188 | High density interconnect structures configured for manufacturing and performance | Kemal Aygun, Ajay Jain, Zhiguo Qian | 2022-07-12 |
| 11380624 | Electromagnetic interference shield created on package using high throughput additive manufacturing | Feras Eid, Shawna M. Liff, Georgios Dogiamis, Johanna M. Swan | 2022-07-05 |
| 11348897 | Microelectronic assemblies | Adel A. Elsherbini, Aleksandar Aleksov, Shawna M. Liff, Johanna M. Swan, Patrick Morrow +3 more | 2022-05-31 |
| 11329359 | Dielectric waveguide including a dielectric material with cavities therein surrounded by a conductive coating forming a wall for the cavities | Georgios Dogiamis, Adel A. Elsherbini, Telesphor Kamgaing, Johanna M. Swan | 2022-05-10 |
| 11329358 | Low loss and low cross talk transmission lines having l-shaped cross sections | Adel A. Elsherbini, Mathew J. Manusharow, Krishna Bharath, Zhichao Zhang, Yidnekachew S. Mekonnen +3 more | 2022-05-10 |
| 11282800 | Substrate integrated inductors using high throughput additive deposition of hybrid magnetic materials | Feras Eid, Georgios Dogiamis | 2022-03-22 |
| 11222847 | Enabling long interconnect bridges | Ravindranath V. Mahajan, Zhiguo Qian, Kemal Aygun, Sujit Sharan | 2022-01-11 |