Issued Patents 2021
Showing 25 most recent of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11205591 | Top via interconnect with self-aligned barrier layer | Kenneth Chun Kuen Cheng, Chanro Park, Chih-Chao Yang | 2021-12-21 |
| 11201112 | Fully-aligned skip-vias | Kenneth Chun Kuen Cheng, Chanro Park, Chih-Chao Yang | 2021-12-14 |
| 11201056 | Pitch multiplication with high pattern fidelity | Chanro Park, Kenneth Chun Kuen Cheng, Chih-Chao Yang | 2021-12-14 |
| 11183455 | Interconnects with enlarged contact area | Oscar van der Straten, Kenneth Chun Kuen Cheng, Joseph F. Maniscalco | 2021-11-23 |
| 11177169 | Interconnects with gouged vias | Kenneth Chun Kuen Cheng, Chih-Chao Yang, Hosadurga Shobha | 2021-11-16 |
| 11177162 | Trapezoidal interconnect at tight BEOL pitch | Nicholas Anthony Lanzillo, Hosadurga Shobha, Huai Huang, Junli Wang, Christopher J. Penny +1 more | 2021-11-16 |
| 11177163 | Top via structure with enlarged contact area with upper metallization level | Chanro Park, Kenneth Chun Kuen Cheng, Chih-Chao Yang | 2021-11-16 |
| 11177214 | Interconnects with hybrid metal conductors | Kenneth Chun Kuen Cheng, Chanro Park, Chih-Chao Yang | 2021-11-16 |
| 11177171 | Encapsulated top via interconnects | Oscar van der Straten, Kenneth Chun Kuen Cheng, Joseph F. Maniscalco | 2021-11-16 |
| 11177170 | Removal of barrier and liner layers from a bottom of a via | Chanro Park, Kenneth Chun Kuen Cheng, Nicholas Anthony Lanzillo | 2021-11-16 |
| 11164815 | Bottom barrier free interconnects without voids | Kenneth Chun Kuen Cheng, Kisik Choi, Cornelius Brown Peethala, Hosadurga Shobha, Joe Lee | 2021-11-02 |
| 11164774 | Interconnects with spacer structure for forming air-gaps | Kenneth Chun Kuen Cheng, Chanro Park, Chih-Chao Yang | 2021-11-02 |
| 11158538 | Interconnect structures with cobalt-infused ruthenium liner and a cobalt cap | Joseph F. Maniscalco, Oscar van der Straten, Scott A. DeVries, Alexander Reznicek | 2021-10-26 |
| 11139201 | Top via with hybrid metallization | Nicholas Anthony Lanzillo, Christopher J. Penny, Somnath Ghosh, Robert R. Robison, Lawrence A. Clevenger | 2021-10-05 |
| 11139202 | Fully aligned top vias with replacement metal lines | Chanro Park, Kenneth Chun Kuen Cheng, Chih-Chao Yang | 2021-10-05 |
| 11127676 | Removal or reduction of chamfer for fully-aligned via | Chanro Park, Kenneth Chun Kuen Cheng, Chih-Chao Yang | 2021-09-21 |
| 11101172 | Dielectric damage-free dual damascene Cu interconnects without barrier at via bottom | Benjamin D. Briggs, Gangadhara Raja Muthinti, Cornelius Brown Peethala, Lawrence A. Clevenger | 2021-08-24 |
| 11094580 | Structure and method to fabricate fully aligned via with reduced contact resistance | Chanro Park, Kenneth Chun Kuen Cheng, Chih-Chao Yang | 2021-08-17 |
| 11081388 | Forming barrierless contact | Kisik Choi, Ashim Dutta, Iqbal Rashid Saraf, Benjamin D. Briggs | 2021-08-03 |
| 11069566 | Hybrid sidewall barrier facilitating low resistance interconnection | Oscar van der Straten, Joseph F. Maniscalco, Scott A. DeVries | 2021-07-20 |
| 11062943 | Top via interconnects with wrap around liner | Nicholas Anthony Lanzillo, Christopher J. Penny, Somnath Ghosh, Robert R. Robison, Lawrence A. Clevenger | 2021-07-13 |
| 11024577 | Embedded anti-fuses for small scale applications | Chanro Park, Kenneth Chun Kuen Cheng, Chih-Chao Yang | 2021-06-01 |
| 10957646 | Hybrid BEOL metallization utilizing selective reflection mask | Benjamin D. Briggs, Cornelius Brown Peethala, Michael Rizzolo, Gen Tsutsui, Ruqiang Bao +2 more | 2021-03-23 |
| 10950493 | Interconnects having air gap spacers | Kenneth Chun Kuen Cheng, Oscar van der Straten, Joseph F. Maniscalco, Chih-Chao Yang | 2021-03-16 |
| 10903116 | Void-free metallic interconnect structures with self-formed diffusion barrier layers | Joseph F. Maniscalco, James J. Kelly, Hosadurga Shobha, Chih-Chao Yang | 2021-01-26 |