Issued Patents 2020
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879190 | Patterning integration scheme with trench alignment marks | Chih-Chao Yang, Hao Tang, Dominik Metzler | 2020-12-29 |
| 10833122 | Bottom electrode and dielectric structure for MRAM applications | Hari Prasad Amanapu, Raghuveer R. Patlolla, Michael Rizzolo | 2020-11-10 |
| 10832917 | Low oxygen cleaning for CMP equipment | Donald F. Canaperi, Pavan S. Chinthamanipeta, Raghuveer R. Patlolla | 2020-11-10 |
| 10825726 | Metal spacer self aligned multi-patterning integration | Hsueh-Chung Chen, James J. Kelly, Yann Mignot, Lawrence A. Clevenger | 2020-11-03 |
| 10818589 | Metal interconnect structures with self-forming sidewall barrier layer | Hari Prasad Amanapu, Raghuveer Patiolla, Chih-Chao Yang | 2020-10-27 |
| 10811310 | Metal spacer self aligned double patterning with airgap integration | Hsueh-Chung Chen, James J. Kelly, Yann Mignot, Lawrence A. Clevenger | 2020-10-20 |
| 10741748 | Back end of line metallization structures | Joseph F. Maniscalco, Raghuveer R. Patlolla, Chih-Chao Yang | 2020-08-11 |
| 10714382 | Controlling performance and reliability of conductive regions in a metallization network | Raghuveer R. Patlolla, Chih-Chao Yang | 2020-07-14 |
| 10714389 | Structure and method using metal spacer for insertion of variable wide line implantation in SADP/SAQP integration | Hsueh-Chung Chen, James J. Kelly, Yann Mignot, Lawrence A. Clevenger | 2020-07-14 |
| 10714681 | Embedded magnetic tunnel junction pillar having reduced height and uniform contact area | Michael Rizzolo, Theodorus E. Standaert | 2020-07-14 |
| 10699945 | Back end of line integration for interconnects | Raghuveer R. Patlolla, Chih-Chao Yang, Roger A. Quon | 2020-06-30 |
| 10685876 | Liner and cap structures for reducing local interconnect vertical resistance without compromising reliability | Su Chen Fan, Hemanth Jagannathan, Raghuveer R. Patlolla | 2020-06-16 |
| 10686126 | Back end of line metallization structures | Joseph F. Maniscalco, Raghuveer R. Patlolla, Chih-Chao Yang | 2020-06-16 |
| 10672653 | Metallic interconnect structures with wrap around capping layers | Kedari Matam, Chih-Chao Yang, Theo Standaert | 2020-06-02 |
| 10672707 | Low aspect ratio interconnect | Benjamin D. Briggs, Elbert E. Huang, Raghuveer R. Patlolla, David L. Rath, Chih-Chao Yang | 2020-06-02 |
| 10658233 | Dielectric damage-free dual damascene Cu interconnects without barrier at via bottom | Koichi Motoyama, Benjamin D. Briggs, Gangadhara Raja Muthinti, Lawrence A. Clevenger | 2020-05-19 |
| 10651125 | Replacement metal cap by an exchange reaction | James J. Kelly | 2020-05-12 |
| 10586767 | Hybrid BEOL metallization utilizing selective reflection mask | Benjamin D. Briggs, Michael Rizzolo, Koichi Motoyama, Gen Tsutsui, Ruqiang Bao +2 more | 2020-03-10 |
| 10573520 | Multiple patterning scheme integration with planarized cut patterning | Hsueh-Chung Chen, Yongan Xu, Lawrence A. Clevenger, Yann Mignot | 2020-02-25 |
| 10534276 | Lithographic photomask alignment using non-planar alignment structures formed on wafer | Chih-Chao Yang, Hao Tang, Dominik Metzler | 2020-01-14 |