Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10672653 | Metallic interconnect structures with wrap around capping layers | Cornelius Brown Peethala, Chih-Chao Yang, Theo Standaert | 2020-06-02 |
KM
Kedari Matam
Overall (2020): #390,831 of 565,922Top 70%
1
Patents 2020