Issued Patents 2003
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6661098 | High density area array solder microjoining interconnect structure and fabrication method | John Harold Magerlein, Kevin S. Petrarca, Carlos J. Sambucetti, Richard P. Volant, George F. Walker | 2003-12-09 |
| 6657305 | Semiconductor recessed mask interconnect technology | Stephen A. Cohen, Timothy J. Dalton, John A. Fitzsimmons, Stephen M. Gates, Brian Herbst +1 more | 2003-12-02 |
| 6646355 | Structure comprising beam leads bonded with electrically conductive adhesive | Sung Kwon Kang | 2003-11-11 |
| 6641899 | Nonlithographic method to produce masks by selective reaction, articles produced, and composition for same | Matthew E. Colburn, Stephen M. Gates, Jeffrey Hedrick, Elbert E. Huang, Satyanarayana V. Nitta +1 more | 2003-11-04 |
| 6632314 | Method of making a lamination and surface planarization for multilayer thin film interconnect | RongQing Yu, Kimberley A. Kelly, Chandrika Prasad, Sung Kwon Kang | 2003-10-14 |
| 6603204 | Low-k interconnect structure comprised of a multilayer of spin-on porous dielectrics | Stephen M. Gates, Jeffrey Hedrick, Satyanarayana V. Nitta, Cristy Sensenich Tyberg | 2003-08-05 |
| 6583847 | Self alignment of substrates by magnetic alignment | Alessandro C. Callegari, Praveen Chaudhari, James P. Doyle, Eileen A. Galligan, James A. Lacey +3 more | 2003-06-24 |
| 6577011 | Chip interconnect wiring structure with low dielectric constant insulator and methods for fabricating the same | Leena Paivikki Buchwalter, Alessandro C. Callegari, Stephan A. Cohen, Teresita O. Graham, John P. Hummel +3 more | 2003-06-10 |
| 6569707 | Method for improving performance of organic semiconductors in bottom electrode structure | Christos D. Dimitrakopoulos, Ioannis Kymissis | 2003-05-27 |
| 6555762 | Electronic package having substrate with electrically conductive through holes filled with polymer and conductive composition | Bernd Karl Appelt, Jeffrey D. Gelorme, Sung Kwon Kang, Voya R. Markovich, Kostas Papathomas | 2003-04-29 |
| 6537908 | Method for dual-damascence patterning of low-k interconnects using spin-on distributed hardmask | Ann R. Fornof, Stephen M. Gates, Jeffrey Hedrick, Satyanarayana V. Nitta, Christy S. Tyberg | 2003-03-25 |